EMTF-07G
<http://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=6421e248
-b8c2-dc11-92db-001422202d38> 

Geographic Strategies for Global Expansion in the Electronic
Interconnect Industry: Where to Invest for Long-Term Business Growth -
Single User License

This study was developed by BPA Consulting Ltd. on commission from IPC.
Its purpose is to provide a comprehensive guide to worldwide investment
for growth-minded companies in the electronic interconnect industry.  It
is an essential source of information and guidance for electronics
industry executives in the process of long-range planning.  The report
offers an analytic structure for comparison of both developed and
developing economic regions and relates them to the specific needs of
companies in the industry.  It identifies and compares the key economic,
social, legislative, educational, logistic and technical factors that
influence the way in which these regions are developing.  It also
describes how key industry sectors are adopting and benefiting from the
local characteristics of each region.  It identifies technological and
market "hot spots" throughout the world for each industry sector and
forecasts the development of industry capabilities and concentrations in
the key regions.   Published December 2007.

 

EMTF-07M
<http://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=2cae0f2d
-bbc2-dc11-92db-001422202d38> 

Microelectronics: The Future of Miniaturization and its Impact on
Electronics Manufacturing - Single License User

This study was developed by Prismark Partners on commission from IPC.
It covers the technology needs, challenges and opportunities that the
trend toward miniaturization presents to all segments of the electronic
interconnect industry.  It assesses the drivers of miniaturization and
related end-product trends, as well as new and evolving technologies
that miniaturization is driving, such as embedded components,
high-density interconnect (HDI) and connector types.  The report
explains where these technologies apply and where they are going.  New
research conducted for this study focused on three major end-product
industries - personal computers, hand-held electronics, and
infrastructure equipment for the datacom/telecom industry - and
addresses the leading OEMs' technology roadmap requirements.  The study
discusses the impact of miniaturization on the supply chain and how it
will drive certain technology and business shifts.  It also offers a
forecast of future technology needs and market opportunities for all
segments of the interconnect industry.  Published December 2007.

 

Visit www.ipc.org/onlinestore or follow the live links above. Both of
these documents are available in single user and global licenses.

 


--------------------------------------------------------------------------------
IPC_New_Releases Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF IPC_New_Releases
Search previous postings at: http://listserv.ipc.org/archives/index.html
Please visit IPC web site (www.ipc.org > Knowledge > Email Forums) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
--------------------------------------------------------------------------------