I agree with this opinion !

 

   Lite-on process engineer  Stone he

 

 

Dear all,

I suspected it’s due to the mechanical damage, may be used as guide hole in punching, routing or E-testing. If there’s problem in the PTH, not only one hole.

 

Besides, the PTH problem usually occurred in the small hole and there is void on the hole wall but not like this --- whole plated metal layer peeled.  If it’s the HSAL process problem, ask them what HSAL machine and the temp setting.

 

 

 

孔壁发黑也会使你误认为没有孔铜的，最直接的办法就是切片观测。如果没有办法，建议你PCB供应商或另外的业务伙伴帮忙切片分析，只有定位缺陷才能彻底解决它。

如果是你怀疑的孔铜缺陷，问题可能就会很严重。

沉铜和电镀如果出现问题，有可能不只是一两个孔的问题。

 

 

----- Original Message -----

From: [log in to unmask]">Li, Nora

To: [log in to unmask]">[log in to unmask]

Sent: Wednesday, January 02, 2008 10:55 AM

Subject: Re: [TGA] PCB問題求救

 

贺工：

 

     你好！你有剖切的图片吗？那张图看得不清楚，如果是PCB孔铜还是x-section 观测判定的结果会准确！

 

   如果只是铅锡层脱落，可能就是铜表面处理存在赃物或氧化的问题导致的了。

 

Best regards,

Nora Li

Senior Field Quality Engineer

                                      Honeywell Aerospace Q

---

From: TGAsia [mailto:[log in to unmask]] On Behalf Of QA Dept.
Sent: 2008年1月2日 10:32
To: [log in to unmask]
Subject: [TGA] PCB問題求救

 

各位兄弟：

我們工廠來料的PCB板連續幾次都出現像附件中的孔銅脫落問題，供方一直都改善不了，不知是啥原因呢，據供方的解釋是因為鍍錫時溫試過高的原因，不知是否有可能呢？

 

我覺的是沉銅時就沒沉好，但又不知是哪裡沒沉好。

 

還有，如果這種問題出現在大孔的地方，那小孔的位置會不會可能出現了？

 

 

 

萬譽電子廠 ：品質部

 

賀雲

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