Hi Chris,
Thanks and BR,
Ilkka Lehtinen
From: Chris Katzko
[mailto:[log in to unmask]]
Sent: 11 January 2008 17:27
To:
Cc: [log in to unmask]
Subject: 答复: [TGA] SMD
components cracking off
Hi Ilkka -
Since
the root cause is still unclear, can you provide some information about the
failure mode?
For
example:
1.
What is the appearance of the solder pads in the missing component locations?
Is there evidence the component was broken off (ie, a solder joint was
formed and then fractured) or any indication of solderability issues (ie, the
pads show de-wetting/non-wetting)? Keep in mind solderability problems
could be due to component issues as well as PCB, but we examine the evidence we
have.
2. If
a component solderability issue is suspected, you might try tracing the
failures to date codes, but with passives used in bulk that might be difficult.
3.
What type and sequence of soldering processes are used? At what step are the
missing components soldered?
4. Are
the components normally glued when placed? Any evidence of problems?
5. Is
missed placement a possibility? In other words, does the assembly
equipment or downstream AOI (if used) detect a missed placement? An indication of this would be perfectly solderd pads without components. Missing is possible
if the placement mechanisms are not properly adjusted, dirty or worn. I'm
assuming they are placed with a high-speed chip shooter, vacuum suction force
and timing may be an issue. Another possiblity is if the tape reels are mishandled before loading or by machine maslfunction.
TGAsia
has many experienced assembly engineers, if you provide more information,
perhaps they can help.
Regards,
C.B.
Katzko, CTO
Meadville Group
e-mail [log in to unmask]
tel +86 21 3774 7528
fax +86 21 3774 7590
mobile +86 13817362590
+++ Please note new tel & fax numbers. +++
Ilkka Lehtinen
<[log in to unmask]> 2008-01-11 16:54
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Hi,
I'm Mr. Ilkka Lehtinen, a Quality Manager in Teleste
Corporation's (a
Finnish company) manufacturing company in
also to join this discussion forum.
Our contract manufacturer has a problem they cannot solve
themselves with
SMD components: every now and then we find boards that
have one or two SMD
capacitors, resistors or inductors fallen off the board
somewhere during the
manufacturing process. The resistors and capacitors are
5-sided termination
components and inductors are bottom only termination
components.
stuff. The size is 0603.
The problem is not location specific so it's not caused
by some mishandling
or that some areas are somehow prone to this kind of
behavior.
I'm out of glues. Has anybody faced this kind of problem
or have any idea?
Thanks in advance,
Ilkka Lehtinen
Quality Manager
Teleste (