Hi John - You may want to check with your part suppliers, there are usually some recommendations on the specification sheets or generic part family spec sheets and they may state some restrictions that limit supplier liability for defective parts after soldering. Check the websites. 120~125C is a good Temp range to remove moisture, 16 hours may be a bit long if the parts are baked in an oxygen (air) environment. The risk is oxidation of the Balls. If you bake in oxygen, make sure the oven is clean and not used for baking any volatile materials such as inks, adhesives, etc that outgass and leave residue on oven walls, this can contaminate parts. If you are baking in a dry nitrogen environment (N2) 16 hours should be OK. IPC/JEDEC J-STD-20C is the industry standard for moisture sensitivity of plastic packages, you may refer to that for background information. This defines the categories of moisture sensitivity used for BGA packages and includes some useful guidelines to plot absorption/desorption curves, etc. Using these methods you can optimize drying time to minimize it without risk. If you haven't got J-STD-20C I suggest your company purchase it, it's a foundation document for Plastic Packages. Regards, C.B. Katzko, CTO Meadville Group e-mail [log in to unmask] tel +86 21 3774 7528 fax +86 21 3774 7590 mobile +86 13817362590 +++ Please note new tel & fax numbers. +++ "John Ling (Jiazhao Ling)" <[log in to unmask]> 发件人: TGAsia <[log in to unmask]> 2008-01-29 10:42 请答复 给 "John Ling (Jiazhao Ling)" <[log in to unmask]> 收件人 [log in to unmask] 抄送 主题 [TGA] New member self-introduction Hello, All: How to set up baking temperature and time to drive humidity off from BGA? Is 125 degree and 16 hours is a reasonable set-up. Thanks! John Ling Loud China