In a message dated 1/8/08 3:17:39, [log in to unmask] writes: > because most components are specified for meeting temp shocks > Sorry Ingemar, but not so. It would be nice if component manufacturers actually considered the soldering process, but for the most part they do not other than lip serice [ e.g., Alloy 42 leadframe TSOPs, thermally assymetric compnents with heat spreaders, leaded components with very stiff leads, etc.] Thermal shock was never a real issue with VP—but solder pooling at the lead shoulders was, because of inadequate pre-heat capabilities. As far as I am concerned, VP is the most elegant soldering technology because of its self-limiting upper T. Werner ************** Start the year off right. Easy ways to stay in shape. http://body.aol.com/fitness/winter-exercise?NCID=aolcmp00300000002489 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------