IPC/JEDEC International Conference on Reliability, Rework and Repair of Lead-Free Electronics Technical Conference - March 11, 2008 Educational Courses - March 12, 2008 Raleigh, N.C. With lead-free soldering processes approved and implemented, increased emphasis is placed on rework and repair as a significant challenge. Considered a weak link in the lead-free process control chain, lead-free soldering requires rigorous control of the thermal process given the higher processing temperatures and reduced process window. The paradox between higher process temperatures of lead-free alloys and the thermal threshold of electronic components during the rework and repair process forms the basis of the lead-free challenge. How reliable is your rework? IPC and JEDEC are pleased to present the International Conference on Reliability, Rework, and Repair of Lead-Free Electronics, March 11-12, 2008, in Raleigh, North Carolina. This conference will address the issues faced as a result of implementing a lead-free process such as alloy choices, component compatibility and solder concerns. For more information or to register, please cut and paste www.ipc.org/RRR0308 into your browswer or contact Alexandra Curtis +1 847-597-2877 or e-mail [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------