Larry, Also there are high and low yield point adhesives. High YP can produce dots higher than the foil, for higher standoff components. Low YP may slump and produce lower dots. Bill MET Assocs -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Kelly Morris Sent: Friday, January 11, 2008 4:26 PM To: [log in to unmask] Subject: Re: [TN] Bottom side SMT adhesives Larry: If you havn't already, you should look at the standoff height, or space undernieth of the problem component packages. SOL's and other SMT packages have more standoff and will require a higher adhesive deposition to get a good bond between component and PCB. If that is the issue, you may have to go to a thicker stencil to get the higher adhesive deposition. Kelly --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------