Do you mean a no-VOC flux or one using alcohol as the solvent? If the former, then all the components in it must be water-soluble, but not necessarily the residues. You have a combination that spells disaster. I know a European telecomms company (a customer of my former company) that had to recall several millions ¤¤¤ of 8 layer backplanes going into street boxes for just the same reason, although it used the most active alcohol-based "no-clean" flux it could find for easy soldering. It changed to water-soluble, good cleaning equipment, contamination control and conformal coating. No problems after that. Overall cost was not much different because the retouch rate dropped dramatically with the W/S flux, as it had problems with solder rise in the PTHs with the NC flux (internal layers slowing down the rise to the extent of flux inactivation). One of the flux manufacturers (Alpha or Multicore?) used to sell heat resistant glass plates to determine flux deposits. You put it on the conveyor like a board and you could see what residues were left after "soldering" it. You could appreciate them either visually or with a simple photometer. Also excellent for showing latitudinal uniformity. May be worth exploring. Brian Joel Alexander wrote: > Hi guys its me again, > > > We have a customer that builds power systems for the Telcom companies. > They recently had a field failure on a backplane. It had sever corrosion. > We process the assembly with a VOC no-clean solder and have never had > issues in the past. The customer indicated that the backplane was in a > damp/moist environment. That is not a good combination for no clean flux. > I suggested cleaning but they insisted that we monitor our flux volume to > ensure it is at the recommended application volume. I did not really agree > from a reliability standard. > > Does anyone out there measure their no clean flux volume on a regular > basis? > > > > Joel Alexander > Quality Assurance Manager > TT APSCO, INC. > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 > ----------------------------------------------------- > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------