Register now for IPC's 2008 upcoming workshops and webcasts! This is your opportunity to gain insight on the latest information regarding the latest issues in electronics! PD-01: Advanced Troubleshooting for Printed Wiring Board Manufacturing - Defect Analysis and Prevention January 15, 2008 - San Jose, CA 8:30 am - 11:30 am Instructor: Michael Carano, Electrochemicals, Inc. Please visit this link for additional information: www.ipc.org/AdvTr0108 Join us for this half-day workshop and gain the process-technology know-how you need to improve the yield, quality and reliability of complex printed wiring boards. Emphasis is on identifying and preventing defects with respect to electroless copper and direct metallization, electroplating, drilling and multilayer fabrication. PD-02: Via Filling Technology and Processes January 15, 2008 - San Jose, CA 1:00 pm - 4:00 pm Instructor: Michael Carano, Electrochemicals, Inc. Please visit this link for additional information: www.ipc.org/AdvTr0108 Attend this course for insights on the technological drivers behind the need for highly effective, reliable via filling in high-density, high-aspect-ratio printed wiring boards. The course pays close attention to the use of via filling materials for highly complex circuit designs. PD-03: Fundamentals of Printed Circuit Technology - Materials and Manufacturing Processes January 16, 2008 - San Jose, CA 8:30 am - 11:30 am Instructor: Joseph Fjelstad, Silicon Pipe, Inc. Please visit this link for additional information: www.ipc.org/AdvTr0108 This half-day course provides a comprehensive overview of this indispensable technology. You will learn about multilayer, metal core, embossed, flexible and rigid flex circuits and more. Discussions will also include newer HDI/microvia and embedded passives technologies, new PCB design concepts and a brief look at the impact of lead free on PCB manufacturing. PD-04: Design Principles for BGA and CSP Technology Implementation January 16, 2008 - San Jose, CA 1:00 pm - 4:00 pm Instructor: Vern Solberg, Tessera Technologies, Inc. Please visit this link for additional information: www.ipc.org/AdvTr0108 This workshop is based on the latest version of the IPC-7095 document, Design and Assembly Process Implementation for BGAs, and covers both wide and fine-pitch BGA packaging methodology. The information will focus on IC packaging standards, review qualification requirements and study land pattern geometry alternatives, circuit routing guidelines as well as important factors related to high density PCB fabrication technologies, assembly process development, inspection criteria and solder quality assessment. IPC Webcast: Printed Board Fabrication Hot Buttons: Design Considerations January 17, 2008 10:00 am - 11:00 am (CT) Instructor: Dieter Bergman, IPC Please visit this link for additional information: www.ipc.org/FabWC0108 Let's face it, designers and board manufacturers don't always tell each other everything! Learn the secrets of the board fabrication process and where manufacturers are compensating for poor and incomplete designer instructions. Mastering this missing information can make your boards more manufacturable and even save you money! Tune in for this informative Webcast and pick up tips to help you become a more effective designer today. IPC Webcast: Routing of High Speed Lines January 24, 2008 10:00 am - 11:00 am (CT) Please visit this link for additional information: www.ipc.org/HighSpeed0108 Many issues contribute to signal integrity problems in high speed transmission lines: cross talk, loss tangent of the PCB material, power bus noise, etc. The single greatest contributor to signal integrity issues is the lack of proper routing and termination of lines in PC boards. Understanding a few simple concepts can take a circuit from failure to success. Understanding the concepts can dramatically reduce cost and layer count of PC boards. PCB Laminate Materials and the RoHS Change: IPC-4101 Specification, Bromine Free and Reliability March 11, 2008 - IPC Headquarters, Bannockburn, IL Instructor: Doug Sober, Kaneka Texas Corporation Please visit this link for additional information: www.ipc.org/PBCLam0308 This one-day workshop focuses on laminate and prepreg materials with a special focus on the grades, properties, testing and composition necessary lead-free assembly. All grades of base materials used in printed boards from low-cost, paper-based (FR-1), to high speed/high-frequency PTFE are analyzed in depth. Manufacturing processes and strategic building blocks for conventional prepreg and laminate production will be introduced. An overview of current markets for these materials will also be discussed. Printed Wiring Board - Back to the Basics March 12, 2008 - IPC Headquarters, Bannockburn, IL Instructor: Michael Carano, Electrochemicals, Inc. Please visit this link for additional information: www.ipc.org/PBCLam0308 The printed circuit board fabrication process is an intricate maze of interrelated steps, both chemical and mechanical. Each step is critical to minimize or eliminate costly defects. In this course, we will identify and explain the basics of printed circuit board fabrication and the different troubleshooting techniques. IPC Webcast Series: Via Hole Filling Technology and Processes Via Hole Filling Technology and Processes: An Overview March 20, 2008 - 10:00 am - 11:00 am (CT) Via Hole Filling Technology and Processes: The Rest of the Story March 27, 2008 - 10:00 am - 11:00 am (CT) Please visit this link for additional information: www.ipc.org/ViaHole0308 This IPC webcast series describes the technological drivers behind the need for via filling in a highly effective and reliable fashion for high density, high aspect ratio printed wiring boards. Close attention is paid to the use of these via filling materials for highly complex circuit designs. For additional information on these workshops and webcasts, please contact Michelle Michelotti at +1 847 597 2822 or at [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------