IPC DRM-18H Component Identification Training and Reference Guide

The Component Identification Training & Reference Guide is a valuable tool for employee training and quick reference. This comprehensive component identification resource for electronics assembly operators and inspectors contains color photographs, computer graphics, schematic symbols and detailed descriptions of more than 50 common through-hole and surface mount components used in electronics assembly today.

The new Revision H contains updated info on SSOP, TSOP, QFP, LQFP, PQFP, LCC, QFN, and BGA-related packages, including all the variations within those groups.

New components include DFN, QFN – Multi Row, PoP (Package on Package), CSP (ChipScale Package), COB (Chip on Board), Bare Die and Flip Chip. Also includes a new section stressing the dangers of cross contamination when using Lead Free components and assemblies.

The Terminology Section has quick facts on polarity, orientation, lead styles and Component Reference Designators (CRDs). The "Reading Component Values" section has full-color, easy-to-use color code charts for resistors and inductors, as well as charts for reading numbered capacitor data. Seventy-three pages. Released December 2007.

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WEBLF0207-CD RoHS Compliance Medical Monitoring & Control Equipment Webcast Series
Our three-part crash course compliance webcast series was designed to present the facts you need to know — FAST! In part one, attendees learned the details for complying with China’s March 1st RoHS-type law, "Administrative Measure on the Control of Pollution Caused by Electronic Information Products." In part two, the European Union's process for adding Category 8 & 9 equipment (medical, monitoring, and control equipment) to the RoHS ban on lead and five other substances was addressed. Part three of the series covered designing a data gathering system to ensure compliance with EU and China RoHS. Released May 2007.