4101B-DE Specification for Base Materials for Rigid and Multilayer Printed Boards - Includes Amendments 1 & 2 - German Language

This is the German language translation of IPC-4101B.

This specification covers the requirements for base materials (laminate and prepreg) for rigid or multilayer printed boards for electrical and electronic circuits. This document contains more than 50 specification sheets and now uses search terms to allow the user to find similar groups of materials from these specification sheets. This standard provides the user with additional information and data on printed circuit board materials that are better able to withstand the newer assembly operations employing higher thermal exposures, including those that use lead free solders. Amendment 1 to Revision B inserts corrected information on Conductive Anodic Filament (CAF) growth into six Specification Sheets and into this document's body. Additionally, Amendment 1 provides corrections for both Permittivity and Loss Tangent in Specification Sheets 126 and 129.

Amendment 2 to Revision B provides seven additional changes: a) Corrects the Z-axis CTE for Specification Sheet 129 to 3.5%; b) In section 3.12.1.4, reference to IPC-9691, a CAF guideline is included for clarity; c) In section 3.10.1.6, a statement is added that recognizes that different test methods yield different results and the specific test method shall be stipulated; d) Dielectric loss tangent values corrected for Specification Sheets 31, 32 and 33; e) Specification Sheet 58 has the minimum Peel Strength requirements increased for all three conditions for standard profile foil; f) In section 3.10.1.12, the test specimens are more closely defined and controlled; and g) More clearly defines what is meant by 20/20 visual acuity. Supersedes IPC-4101B with Amendment 1. 110 pages. Released March 2007. Available in hard copy and electronic formats.

2221A-DE Generic Standard on Printed Board Design - German Language

This is the German Language version of IPC-2221A.

IPC-2221A is the foundation design standard for all documents in the IPC-2220 series. It establishes the generic requirements for the design of printed boards and other forms of component mounting or interconnecting structures, whether single-sided, double-sided or multilayer. Among the many updates to Revision A are new criteria for surface plating, internal and external foil thicknesses, component placement and hole tolerances. Expanded coverage is provided for material properties, dimensioning and tolerancing rules, and via structures as well as updated coupon designs for quality assurance. 112 pages. Released May 2003. Available in hard copy and electronic formats.

2222-DE Sectional Design Standard for Rigid Organic Printed Boards - German Language

This is the German language translation of IPC-2222.

Used in conjunction with IPC-2221A, IPC-2222 establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. This standard applies to single-sided, double-sided or multi-layered boards. Key concepts in this document are: rigid laminate properties, designer/end user materials section map, and scoring parameters.

The IPC-2221A and IPC-2222 together supersede IPC-D-275. 35 pages. Released February 1998. Available in hard copy and electronic formats.

A-620A-SP Requirements and Acceptance for Cable and Wire Harness Assemblies - Spanish Language

This is the Spanish language translation of IPC-WHMA-A-620A.

Revision A is now available for the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC and the Wire Harness Manufacturers Association teamed to develop this significant update, adding lead free acceptance criteria, a new chapter devoted to electrical and mechanical testing, and enhanced criteria for molding and splicing.

This Revision has 599 full-color pictures and illustrations - nearly 100 new. Readability and usability were improved based on user feedback from the original release. Included in the 19 chapters are criteria for wire prep, soldering to terminals, crimping of stamped and formed contacts and machined contacts, insulation displacement connectors, ultrasonic welding, splicing, connectors, molding, marking, coax/twinax cables, wrapping/lacing, shielding, assembly and wire-wrap terminations. 368 pages. Released July 2006. Available in hard copy and electronic formats.

 

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