This message was initially sent to members of the IPC Assembly and Joining and related committees. After reviewing the information below, if you have an interest in being part of the developing and balloting committee for this document, you must reply to the IPC staff liaison [log in to unmask] advising of your interest and you will be added to the IPC B-10a task group. J-STD-075 Classification of Non-IC Electronic Components for Assembly Processes is an outgrowth of IPC/JEDEC J-STD-020 "Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices" and IPC-9503 Moisture Sensitivity Classification for Non-IC Components. These two documents focus on issues related to moisture absorption in non-hermetic electronic components. There is a shortfall in standards and test methods that can be used to test and classify components that may be damaged from thermal damage during the assembly process. J-STD-075 is a fast-track document that being developed through collaboration of Electronic Components Association, IPC, and JEDEC. Efforts to this point has primarily been at the working group level as agenda items in conjunction with other ECA or JEDEC events with minimal input from component users. The classification levels that will be established by this standard will have significant impact to assemblers and your review and comments are encouraged. A copy of J-STD-075 is available for your review. The file is in PDF format and can be opened with the freeware Adobe Acrobat Reader (www.adobe.com). Included with the file is a ballot comment form. The document, comment list and comment form can be downloaded from: http://files.ipc.org/J-STD-075-ballot.zip We are now using an online survey tool to enable you to more easily submit your vote. After you have reviewed the document, please access the following link to submit your ballot: http://www.surveymonkey.com/s.aspx?sm=Oz9EnYV708ql4cGmoqzmJQ_3d_3d PLEASE NOTE THAT ONLY ONE VOTE CAN BE COUNTED PER COMPANY SITE. If you have comments, please return the comment form to [log in to unmask] with "J075 comments" in the subject line. All technical comments must be responded to in writing from the task group leaders and the IPC staff. These records become a permanent part of the document file. If the comments are editorial in nature, they can be incorporated and need no official response. Editorial comments are not grounds for rejection. Please return all comments to Jack Crawford at IPC Headquarters as soon as possible, or by December 14, 2007 at the latest. We would like to give special thanks to Steve Martell, Sonoscan, for leading the IPC effort on this important project. Jack Crawford, IOM IPC Director Certification and Assembly Technology [log in to unmask] 847-597-2893 FAX 847-615-5693 3000 Lakeside Drive, Suite 309 S Bannockburn, IL, 60015 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------