Registration is now open for IPC's upcoming workshops in January, February and March of 2008! This is your opportunity to gain in-sight on the latest information regarding current issues on the latest in electronics! Advanced Troubleshooting for Printed Wiring Board Manufacturing - Defect Analysis and Prevention January 15, 2008 - San Jose, CA 8:30 am - 11:30 am Instructor: Michael Carano, Electrochemicals, Inc. What are the critical success factors for a defect-free PWB fabrication process and maximum long-term reliability? This course tackles the answers! Join us for this half-day workshop and gain the process-technology know-how you need to improve the yield, quality and reliability of complex printed wiring boards. Emphasis is on identifying and preventing defects with respect to electroless copper and direct metallization, electroplating, drilling and multilayer fabrication. Via Filling Technology and Processes January 15, 2008 - San Jose, CA 1:00 pm - 4:00 pm Instructor: Michael Carano, Electrochemicals, Inc. Attend this course for in-sights on the technological drivers behind the need for highly effective, reliable via filling in high-density, high-aspect-ratio printed wiring boards. The course pays close attention to the use of via filling materials for highly complex circuit designs. Fundamentals of Printed Circuit Technology - Materials and Manufacturing Processes January 16, 2008 - San Jose, CA 8:30 am - 11:30 am Instructor: Joseph Fjelstad, Silicon Pipe, Inc. This half-day course provides a comprehensive overview of this indispensable technology. It reviews the materials and processes that comprise the wide array of electronic interconnection substrates used today and why they were chosen. You will learn about multilayer, metal core, embossed, flexible and rigid flex circuits and more. Discussions will also include newer HDI/microvia and embedded passives technologies, new PCB design concepts and a brief look at the impact of lead free on PCB manufacturing. Design Principles for BGA and CSP Technology Implementation January 16, 2008 - San Jose, CA 1:00 pm - 4:00 pm Instructor: Vern Solberg, Tessera Technologies, Inc. This workshop is based on the latest version of the IPC-7095 document, Design and Assembly Process Implementation for BGAs, and covers both wide and fine-pitch BGA packaging methodology. The information will focus on IC packaging standards, review qualification requirements and study land pattern geometry alternatives, circuit routing guidelines as well as important factors related to high density PCB fabrication technologies, assembly process development, inspection criteria and solder quality assessment. Register for these courses by December 21 and receive a 10% discount or register three individuals from your company at the same time and receive the fourth registration FREE. For more information or to register, please cut and paste www.ipc.org/AdvTr0108 into your browser and download the registration form. Fundamentals of Printed Circuits - Materials, Structures and Processes February 12, 2008 - Phoenix, AZ 8:30 am - 5:00 pm Instructor: Joseph Fjelstad, Verdant Electronics PCBs are the electrical interconnection platform for nearly every electronic product. This tutorial provides a detailed overview of this indispensable technology. It reviews the materials and processes that comprise the wide array of electronic interconnection substrates used today - and explains why they were chosen. Desmear Metallization and Plating of Flex & Rigid Flex Printed Wiring Boards February 14, 2008 - Phoenix, AZ 8:30 am - 11:30 am Instructor: Michael Carano, Electrochemicals, Inc. Understanding the intricate nature of materials and processes is critical to ensuring highly reliable performance of printed wiring boards. In this workshop, you will gain insights and get recommendations on the desmear and metallization of flexible, rigid-flex and high-performance rigid materials. Direct metallization will be compared and contrasted to conventional electroless copper systems. Be sure to join us for this enlightening workshop! Advanced Troubleshooting for Printed Wiring Board Manufacturing - Defect Analysis and Prevention February 14, 2008 - Phoenix, AZ 1:00 pm - 4:00 pm Instructor: Michael Carano, Electrochemicals, Inc. What are the critical success factors for a defect-free printed wiring board fabrication process and maximum long-term reliability? This course tackles the answers! Join us for this half-day workshop and gain the process-technology know-how you need to improve the yield, quality and reliability of complex printed wiring boards. Register for these courses by January 14, 2008 and save an additional 10% off the current registration prices or register three individuals from your company at the same time and receive the fourth registration FREE. For more information or to register, please cut and paste www.ipc.org/Interim0208 into your browser and download the registration form. Design for Manufacture, Assembly and Test Hosted by Hunter Technology- Santa Clara, CA February 26-27, 2008 8:30 am - 5:00 pm Instructor: Dieter Bergman, IPC Designing printed board assembly is more difficult today than ever before. Printed board designers are faced with the continuing design issues of surface mount vs. through-hole technology, what materials to use, board size and layer count, how to incorporate electrical testing, impedance control requirements, and what new specifications are being invoked on the design process and many other topics. The tolerance characteristics that make sense using the capabilities of today's manufacturing equipment will also be discussed. Attendees will have a unique opportunity to obtain first hand information on design issues that affect PCB assembly. Register for this course by January 28, 2008, and save an additional 10% off the current registration prices or register three individuals from your company at the same time and receive the fourth registration FREE. For more information, please cut and paste www.ipc.org/DFAHunter into your browser and download the registration form. PCB Laminate Materials and the RoHS Change: IPC-4101 Specification, Bromine Free and Reliability March 11, 2008 - Bannockburn, IL Instructor: Doug Sober, Kaneka Texas Corporation This workshop focuses on laminate and prepreg materials with a special focus on the grades, properties, testing and composition necessary lead-free assembly. All grades of base materials used in printed boards from low-cost, paper-based (FR-1), to high speed/high-frequency PTFE are analyzed in depth. Manufacturing processes and strategic building blocks for conventional prepreg and laminate production will be introduced. An overview of current markets for these materials will also be discussed. Printed Wiring Board - Back to the Basics March 12, 2008 - Bannockburn, IL Instructor: Michael Carano, Electrochemicals, Inc. The printed circuit board fabrication process is an intricate maze of interrelated steps, both chemical and mechanical. Each step is critical to minimize or eliminate costly defects. In this course, we will identify and explain the basics of printed circuit board fabrication and the different troubleshooting techniques. Register for this course by February 11, 2008, and save an additional 10% off the current registration prices or register three individuals from your company at the same time and receive the fourth registration FREE. For more information, please cut and paste www.ipc.org/PBCLam0308 into your browser and download the registration form. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------