Hi, Keep in mind that in vacuum, there is no forced air convection, only heating by radiation and conduction so you gain from low boiling point a evaporation but you loose the air convection. You should verify that each tray should touch the metal shelf for the temp. conduction. Best Regards Reuven ROKAH e mail: [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke Sent: Tuesday, November 20, 2007 9:52 PM To: [log in to unmask] Subject: Re: [TN] Vacuum Baking of MSDs Not sure why it would be thought to reduce the time anyway? Reducing the pressure will lower the boiling point and hence the temperature needed to remove the moisture from the package - but I do not see any reason why there should be t\a time reduction expectation. Now if the temperature was left at 100C+ and the vacuum applied then that would definitely lead to a shorter time expectation but might also lead to package damage.........8-) John Burke (408) 515 4992 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Gumpert, Ben Sent: Tuesday, November 20, 2007 10:27 AM To: [log in to unmask] Subject: [TN] Vacuum Baking of MSDs Anyone want to make a comment (to support or refute) on the following statement regarding moisture sensitive parts? "Contrary to some claims, vacuum was not found to accelerate the rate that moisture is withdrawn from a plastic package." >From the following article: http://circuitsassembly.com/cms/content/view/5610/95/ Ben --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------