Currently we have assemblers who are hand fluxing some TH components at the slide line prior to the wave. Some believe that when it comes to hand fluxing more is better and flood a whole section of a PCB with flux. My concern is that some of the assemblies that have been flooded with flux, on the primary side, will have active material left behind after the wave process. I know that this is a training issue and I would say that 90% do not need to have flux added and with out the flux we get a perfect class 2 solder joint. I am working on changing the mind set that top flow is necessary to be an acceptable class 2 joint. I have an assembly array that I would like to flood one side with flux and leave the other side alone, send it through the wave process and then throw it into an environmental chamber. My question is can anyone give me an idea on what the best settings would be to get the results I am looking for? I am trying to prove or disprove that there is some active agents left on the assembly and the pre-heaters are not enough to remove them all. I can not use SIR testing because I am looking for specific locations of active agents, not an overall level of contamination across the array. Ion chromatographs are out of the question due to the cost of testing. I would also like to use this as a visual aid when it comes to the retraining of assemblers, if it really is an issue. Thank you, Ted Tontis Quality Engineer Borg Indak, Inc. 701 Enterprise Dr Delavan, WI 53115 P 262-245-3060 F 262-728-3788 [log in to unmask] www.borgindak.com <http://www.borgindak.com/> --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------