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ENGINEERING RELIABILITY
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On 31 Oct 2007, at 18:48, Guy Ramsey wrote:

> In truth, it is my understanding that the flux was changed because  
> nobody
> uses pure rosin flux anymore. They only reason the flux makers  
> produced it
> was for solderability testing.
>
> The new flux specification was supposed to reflect real world  
> performance
> requirements. We are using an L0 flux. But, I am sure it performs much
> better, in the real world than the material specified in  previous  
> revision
> of the standard; False calls.
>
> Though, I suspect that someone using pure rosin flux could have  
> issues with
> components that pass the current tests.
>
> Dave?
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Dennis Fritz
> Sent: Wednesday, October 31, 2007 2:32 PM
> To: [log in to unmask]
> Subject: Re: [TN] Flux
>
>
> Guys,
>
> I am vice chairman of the 5-23b committee on solderability with Dave
> Hillman as the chairman.  I do not officially remember why this was
> changed, but it was for a reason - not willy-nilly.  My suggestions  
> are
> either:
> 1. Because of some change in the J-004 standard on flux, or 2. The  
> changed
> flux reduced the chance of false calls in the test.
>
> I have a reinforcing note to Dave Hillman to get you an answer.  And,
> please review the information still carried on the committee web site:
>
> _http://members.ipc.org/commReg/CommRegFile.asp? 
> PDFTYPE=min&ComName=Componen
> t%
> 20and%20Wire%20Solderability%20Specification%20T.G&comm=5-23B_
> (http://members.ipc.org/commReg/CommRegFile.asp? 
> PDFTYPE=min&ComName=Componen
> t%20and%20Wire%20
> Solderability%20Specification%20T.G&comm=5-23B)
>
> From a quick scan, I don't see where this change is called out in the
> minutes.  Again, you can review most any of the IPC committtee  
> work, by
> going as
> follows:
>
> 1.  IPC Web page
> 2.  Standards (that is under the Knowledge header) 3. Standards  
> Development
> 4. Committee Home pages 5. Then, you have to be somewhat familiar  
> with the
> IPC committee structure to know where to search.  Assembly  
> standards tend to
> all be under committee 5-20 Assembly and Joining.  J-002 is under  
> Committee
> 5-23B.
> 6. Try it and you will like it (Dr. Suess).
>
> Denny Fritz
> MacDermid, Inc.
>
>
> In a message dated 10/31/2007 1:32:03 P.M. Eastern Daylight Time,
> [log in to unmask] writes:
>
> New  consensus . . . Who sits on these committees?
>
> -----Original  Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Sue  Powers- 
> Hartman
> Sent: Wednesday, October 31, 2007 12:36 PM
> To:  [log in to unmask]
> Subject: [TN] Flux
>
> The new JStd-002B 3.2.2 states  that ROL1 flux shall be used for
> solderability testing, while the old Rev  JStd-002A 3.2.2 calls out  
> ROL0
> Flux.  Does anyone know why this was  changed?
>
>
>
>
>
>
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