原来我做过FPC的evaluation. 感觉切片的准确度高一些, 但覆盖的面不够.
好像IPC没有这方面的标准吧? 我们原来做过导电炭粉的印刷, 不知道你pattern单品是如何排列的, 尽量不要排到网版的外边, 那样张力比较大,
印刷材料不容易透过, 而且网版的厚度, 密度以及刮刀的硬度及压力,速度都是需要重要考查的东东... 不过关于厚度的测试,
如果你的软板是比较平整的,或者可以粘到比较平整的平面上, 建议你用光学的焦点深度仪, 在线路板表面对焦清零, 然后取印刷区域的边缘4个点及中间一个点,
就可以看到银浆的分布状况及平均厚度了. 如果还是不行, 还可以用X-RAY测量, 不过那样的精度不是很好, 重复性也不如前者好.
不知道你们是什么样的工艺流程? 不同的流程会有不同的测试方法.
评价的手段及时间要求也不同.
Best regards,
Andy Duan (Shi
Hao)
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如何测试软板上印刷导电银浆的厚度?有无相关的IPC标准要求?我们现在通行的做法是两种;金相切片和千分尺,但是两者相差非常大.本人偏向采用金相切片方式,但是一直找不到相关的依据!请不吝赐教!谢谢!
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