Register by October 15th and save! Design for Assembly Workshop November 12-13, 2007 - Houston, TX Instructor: Gary Roper, Roper Resources & Dieter Bergman, IPC Designing printed boards is more difficult today than ever before. Printed board designers are faced with the continuing design issues of surface mount vs. through hole technology, what materials to use, board size and layer count, how to incorporate electrical testing, what new specifications are being used in the design process and many other topics. This course will address trade-offs for designs that have both through-hole and surface mount components. The tolerance characteristics that make sense using the capabilities of today's manufacturing equipment will also be discussed. Attendees will have a unique opportunity to obtain first hand information on design issues that affect manufacture. Register early and save 10% off the current registration fee or take advantage of our special offer - register three participants and get fourth free! For more information or to register, please cut and paste www.ipc.org/DFA1107 <http://www.ipc.org/DFA1107> into your browser and download the registration form. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------