This IPC event is filling up fast! Sign up and get the latest on this hot topic! Via Hole Filling Technology and Processes Webcast Series Speaker: Michael Carano, Electrochemicals, Inc. An Overview November 1, 2007 10:00 a.m. - 11:00 a.m. (CT) The Rest of the Story November 8, 2007 10:00 a.m. - 11:00 a.m. (CT) This IPC webcast series describes the technological drivers behind the need for via filling in a highly effective and reliable fashion for high density, high aspect ratio printed wiring boards. Close attention is paid to the use of these via filling materials for highly complex circuit designs. For more information, or to register, please visit www.ipc.org/ViaHoleWC. For additional questions, contact Michelle Michelotti at 847.597.2822 or e-mail at [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------