You probably can get a stencil made like this, but the slumping of the paste would be a problem. I presume the reason for this spacing in the test pattern is to have spacings that give you shorts from slumping and no shorts at wider spacings. If you did not have such a range, you could not determine at what distance you would get shorts and when not. Have fun, Ahne. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Gervascio, Thomas Sent: Friday, 19 October, 2007 12:18 To: [log in to unmask] Subject: [TN] Solder paste slump patterns Got a question, I was looking at the IPC-A-21 solder paste slump pattern and noticed that some of the spacings between pads were 0.05mm, .1 mm- this is .002" and 0.004"- and I can't imagine being able to etch a stencil with these spacings. Am I reading something wrong here? Any other newer solder paste slump patterns out there? Thanks Tom --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------