From: John Ling (Jiazhao
Ling) [mailto:[log in to unmask]]
Sent: Tuesday, September 18, 2007
12:08 PM
To: Asia Committe Task Group
Forum; Haley Deng
Subject: [TGA] Chip LED Reflow
condition
The
bonding wire broken near bonding point. Befroe introducing RoHS, we don't have
problemon chip LED reflow. TRhe failed LED can light, when mnual solder it
agian. We still have PTH LED with 2% reject rate on wave sodlering which we
don't have this problem before.
----- Original Message
-----
Sent: Tuesday, September 18,
2007 11:29 AM
Subject: Re: [TGA] Chip LED
Reflow condition
Dear John,
What about failure model, ATE
test or crack?
Haley
From: John Ling (Jiazhao
Ling) [mailto:[log in to unmask]]
Sent: Tuesday, September 18, 2007
11:19 AM
To: Asia Committe Task Group
Forum; Haley Deng
Subject: Chip LED Reflow condition
Our
Chip LED has 10% failure after RoHS reflow. DO you Have any idea to control it?
Thanks!
John Ling
Loud China
Confidential Information:This
message is sent to the intended recipient and may contain privileged or
confidential information. If you received this transmission in error, please
notify the sender with a replying e-mail and delete the message and any
attachment.Transmission Caveat and Virus
Alert: Internet communications cannot be guaranteed to be timely,
secure, error or virus-free. The sender does not accept liability for any
errors or omissions.For additional information, please visit our website at
www.liteon.com