This is a multi-part message in MIME format. Has anyone experienced the defects illustrated in the 4 attached images? We are confident that these were properly tested at bare-board electrical test, and that these apparent opens must have completely separated later. Assemblies show some failures due to high-R at these kinds of defects (this one was a complete open). We don't believe they were visible at AOI, but are attempting to replicate them and verify this. We are guessing that a foil weakness existed at lamination, but failure did not occur until subsequent thermal or mechanical stress during assembly or in the field. Anyone have any thoughts? Thanks very much. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------