Hi Liu,
 
In your question, you said Siemens and now you say Fuji.
What's your actual problem???
If you didn't tell real problem, no one can help you.
 
Note: Your problem is high component throw out or pick up error?
 
Aquino

 
On 8/14/07, FP Deng <[log in to unmask]> wrote:

Normally, HS50 machine is able to automatically adjust mouting height. Re-verify the programming and machine are most important for your consideration rightnow,  we have no such big throw out rate on SP HS50
But the issue like you said has offen occured on Fuji CP6,and CP7 machine. due to it has no the function.



Liu Qixiong <[log in to unmask]>
Sent by: TGAsia <[log in to unmask]>

2007-08-14 15:52

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Subject
[TGA] 0402 电阻填充高度






Dear all,

下午好!


有个问题,请教各位。


目前我们有2个物料,均为0402贴片电阻,分别为2个不同供应商,在Siemens上贴片抛料率不同,

A物料为0.3%;B物料为2.4%。对比两物料,填充高度不同。


(定义:物料填充高度=物料高度/料槽高度)


A物料的填充高度约为73.3% ;B物料的填充高度约为67.5%,行业标准对于物料与料槽是否与焊料

的填充高度一样,有个统一的推荐标准?


供应商提供的规格,物料高度为0.35+/-0.05mm ,料槽高度为0.52+/-0.05mm,物料是满足规格

要求的,我们有什么标准可以合理建议供应商修改物料规范呢。是否需要供应商的来料也需要满足

填充高度的要求?


以上,谢谢!


Thanks and Best regards,
QiXiong Liu / 刘启雄
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Shenzhen Kaifa Tech. Co., Ltd
TEL:(86-755) 8303 2489  Ext: 33489
E-MAIL:[log in to unmask]

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