Hi Liu,

In your question, you said Siemens and now you say Fuji.
What's your actual problem???
If you didn't tell real problem, no one can help you.

Note: Your problem is high component throw out or pick up error?

Aquino


On 8/14/07, FP Deng <[log in to unmask]> wrote:
>
>
> Normally, HS50 machine is able to automatically adjust mouting height.
> Re-verify the programming and machine are most important for your
> consideration rightnow,  we have no such big throw out rate on SP HS50
> But the issue like you said has offen occured on Fuji CP6,and CP7 machine.
> due to it has no the function.
>
>
>
>   *Liu Qixiong <[log in to unmask]>*
> Sent by: TGAsia <[log in to unmask]>
>
> 2007-08-14 15:52   Please respond to
> Asia Committe Task Group Forum <[log in to unmask]>; Please respond to
> [log in to unmask]
>
>    To
> [log in to unmask]  cc
>   Subject
> [TGA] 0402 电阻填充高度
>
>
>
>
>
> Dear all,
>
> 下午好！
>
> 有个问题，请教各位。
>
> 目前我们有2个物料，均为0402贴片电阻，分别为2个不同供应商，在Siemens上贴片抛料率不同，
> A物料为0.3%；B物料为2.4%。对比两物料，填充高度不同。
>
> （定义：物料填充高度=物料高度/料槽高度）
>
> A物料的填充高度约为73.3%；B物料的填充高度约为67.5%，行业标准对于物料与料槽是否与焊料
> 的填充高度一样，有个统一的推荐标准?
>
> 供应商提供的规格，物料高度为0.35+/-0.05mm，料槽高度为0.52+/-0.05mm，物料是满足规格
> 要求的，我们有什么标准可以合理建议供应商修改物料规范呢。是否需要供应商的来料也需要满足
> 填充高度的要求？
>
> 以上，谢谢！
>
> Thanks and Best regards,
> QiXiong Liu / 刘启雄
> *******************************************
> Shenzhen Kaifa Tech. Co., Ltd
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