各位:
请教实装基板中位置认知标识的识别方式及标识的规格要求;感谢!
SUYONGLIANG/
FOSHAN TOKAI RIKA
AUTOMOTIVE PARTS CO.LTD
QUALITY DEPARTMENT
From:
TGAsia [mailto:[log in to unmask]] On Behalf Of Liu
Qixiong
Sent: Thursday, August 09, 2007
11:41 AM
To: [log in to unmask]
Subject: Re: [TGA] 请教PCB板变形&焊盘设计
Hi, FP
Information as follow,
Supplier: ERSA model of IR
Material: Material :FR-4・t=1.04・6層
Mothod: Top\bottom preheat with infrared ray heat on
BGA station.
We shall try to convince customer with fixture again.
Best regards,
Thanks and Best regards,
QiXiong Liu / 刘启雄
*******************************************
Shenzhen Kaifa Tech. Co., Ltd
TEL:(86-755) 8303 2489 Ext: 33489
E-MAIL:[log in to unmask]
*******************************************
FP Deng
<[log in to unmask]> 2007-08-09 10:28
|
|
Hi, Liu
Can you tell me what kind of rework machine you currently use ,SRT. DRS. ERSA
or peace machine and others?
BTW, If your machine' function limitation , you actually can use special fixutre
for it, but note that the strain gage test from both fixture and thermal shock
is one way to convince yr custormer.
Regards.
FP Deng
Liu Qixiong
<[log in to unmask]> 2007-08-09 09:43
|
|
It is true and customer worry about reliability problem and we wasn't allowed
to rework by special fixture.
Thank you for your attention.
Thanks and Best regards,
QiXiong Liu / 刘启雄
*******************************************
Shenzhen Kaifa Tech. Co., Ltd
TEL:(86-755) 8303 2489 Ext: 33489
E-MAIL:[log in to unmask]
*******************************************
FP Deng
<[log in to unmask]> 2007-08-09 09:17 |
|
Although the fixture is normally way for such issue. stress issue from unbalanced
thermal shock to components should be deeply considered.
Evaluation have to be conducted to reduce the thermal shock. ......
Brian Hung
<[log in to unmask]>
2007-08-09 08:52
|
|
关于问题2):
惯用的办法是做个夹具压平它.
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Liu Qixiong
Sent: Thursday, August 09, 2007 8:23 AM
To: [log in to unmask]
Subject: [TGA] 请教PCB板变形&焊盘设计
Dear all,
早上好!
目前遇到2个问题,有些疑问,需要各位给出些建议:
1)我们遭遇到连锡,发现PCB板0805与0402焊盘间距离有
距离为
从IPC标准上查,发现有光板导体间安全电气距离为
于焊盘设计的安全距离,不知有其他IPC标准规定?另牵引力的分析,是否有理论依据?
象这种情况,如果PCB焊盘设计更改困难,有否其他工艺方法改善?
2)生产线PCB板尺寸为190x
在返修BGA台返修时,发现PCB板很容易变形,弓曲变形80%超过0.75%的标准(IPC-A-610D
不知有无好的工艺方法能避免PCB板变形?
因刚加入这个组织,也许之前有讨论过,还请多多包涵。
以上,非常感谢。
Thanks and Best regards,
QiXiong Liu / 刘启雄
*******************************************
Shenzhen Kaifa Tech. Co., Ltd
TEL:(86-755) 8303 2489 Ext: 33489
HP: 13480838497
E-MAIL:[log in to unmask]
*******************************************
This message has been scanned.
(210.245.235.14)
Legal Disclaimer: The information contained in this message may be privileged
and confidential. It is intended to be read only by the individual or entity to
whom it is addressed or by their designee. If the reader of this message is not
the intended recipient, you are on notice that any distribution of this
message, in any form, is strictly prohibited. If you have received this message
in error, please immediately notify the sender and delete or destroy any copy
of this message
This message has been scanned.
(210.245.235.14)
This message has been scanned.
(210.245.235.14)
This message has been scanned.
(210.245.235.14)
This message has been scanned.
(210.245.235.14)