Hi Victor, You may also look at Engelmaier, W., “How to Specify PCBs to Reliably Survive RoHS-Mandated Lead-Free Soldering Processes,” IPC Review, Vol. 48, No. 7, August 2007, pp. 17-22, Engelmaier, W., “How to Specify Reliable PCBs for Lead-Free Solder Assembly,” Global SMT & Packaging, Vol. 6, No. 8, September 2006, pp. 54-56, Engelmaier, W., “How to Specify Reliable PCBs for Lead-Free Solder Assembly, Part 2,” Global SMT & Packaging, Vol. 7, No. 1, January 2007, pp. 64-66, Engelmaier, W., “Printed Circuit Board Reliability: Loss of Life During Soldering,” Global SMT & Packaging, Vol. 6, No. 9, October 2006, pp. 46-47, Engelmaier, W., “Non-Functional Lands: Keep Them vs. Remove Them,” Global SMT & Packaging, Vol. 6, No. 6, June/July 2006, pp. 48-50, Engelmaier, W., “Printed Circuit Board Reliability Issues,” Global SMT & Packaging, Vol. 1, No. 3, October 2001, pp. 44-45; also in IPC Review, Vol. 46, No. 9, October 2005, pp.14-15. Enough? Werner ************************************** Get a sneak peek of the all-new AOL at http://discover.aol.com/memed/aolcom30tour --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------