When you say pads are lifting, do you mean a partial or total adhesive
separation of the pad and laminate substrate or a cohesive failure of
the laminate itself under the pad?
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ray, Carl (GE
Indust, GE Fanuc)
Sent: Tuesday, August 07, 2007 1:01 PM
To: [log in to unmask]
Subject: [TN] Pads removed during BGA Repair

All,
 Got a question or two for the group. We have a situation where we are
experiencing pads and traces being lifted during BGA removal. We use an
Summit 1800 Machine and have verified calibration and thermal profiles
(even used an external device, ECD Mole to verify the profiles and
temps). The products range in sizes as well as the BGAs. The surface
finish is ENIG and the board venders are the same for all the products.
Some of the products are Pb Free and others are standard lead products. 
 What types of testing can be done to verify tensile strength and copper
adhesion? What other actions would you recommend?

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