Leo, I would be interested in that too. I certainly don't have any data. I do wonder if the Motorolas and the Nokias of the world do, but will they share? :) I'm not sure I would if I had the data. My GUESS would be that there would be little or not effect UNLESS there was massive debonding of the glass fibers to the epoxy resin, which could then also give you problems with regards to CAF growth. Bev RIM -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Leo Higgins Sent: Tuesday, August 28, 2007 5:11 PM To: [log in to unmask] Subject: [TN] PCB matl properties - water effect Hi folks, I did not get any responses to my first try with this question, so I will try again. Can anyone provide reference info on the mechanical properties of PCB materials when dry (baked out), and when saturated with water vapor at a range of use temperatures? I am especially interested in modulus data, flexural strength, and any properties that may effect a small board's response to impact in drop testing of portable products. Thanks. Best regards, Leo Leo M. Higgins III, Ph.D. Sr. Vice President, Engg and Technology ASAT, Inc. 13809 Research Blvd., Suite 635 Austin, Texas 78750 office phone 512-249-4758 mobile 512-423-2002 [log in to unmask] www.asat.com --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------------------------- This transmission (including any attachments) may contain confidential information, privileged material (including material protected by the solicitor-client or other applicable privileges), or constitute non-public information. Any use of this information by anyone other than the intended recipient is prohibited. If you have received this transmission in error, please immediately reply to the sender and delete this information from your system. Use, dissemination, distribution, or reproduction of this transmission by unintended recipients is not authorized and may be unlawful. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------