Or claim it was a case of mistaken i"dent"ity. This was a test for the probing minds out there. Dewey -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Kevin Glidden Sent: Tuesday, August 07, 2007 7:03 AM To: [log in to unmask] Subject: Re: [TN] Dent on BGA Pad Reference IPC-6012B, section 3.5.4.2.2 "Round Surface Mount Lads (BGA Pads)" "One electrical test probe "witness" mark is allowed within the pristine area for Class 1, 2, and 3." The shape of the dent (great photo) definitely is indicative of a test probe. While allowed, I also agree it looks a bit deep, so the advice to contact the supplier is sound. They may be able to swap pins for something with less force. Good luck. Kevin Glidden Manufacturing Engineer Luminescent Systems Inc. -----Original Message----- From: Kane, Amol (349) [mailto:[log in to unmask]] Sent: Tuesday, August 07, 2007 9:18 AM To: [log in to unmask] Subject: Re: [TN] Dent on BGA Pad Thanks Steve and Kerry for the feedback.....greatly appreciated!...I think I will grab a hold of that spec and go thru it Regards, Amol -----Original Message----- From: Steve Gregory [mailto:[log in to unmask]] Sent: Tuesday, August 07, 2007 8:26 AM To: Kane, Amol (349) Cc: TechNet E-Mail Forum Subject: RE: [TN] Dent on BGA Pad Hi Again Amol! I have your picture posted. It's at: http://stevezeva.homestead.com/files/Dent_on_BGA_Pad.jpg That looks like an awfully deep probe mark to me. Yes, something like that will cause voids. I did find this in the IPC-6012A with Amendment 1 - Qualification and Performance Specification for Rigid Printed Boards on page 10: 3.5.4.2 Surface Mount Lands - Defects such as nick, dents, and pinholes along the edge of the land shall not exceed 20% of either the length or width of the land for Class 2 or Class 3 boards, or 30% for Class 1. Defects internal to the land shall not exceed 10% of the length or width of the land for Class 2 or Class 3 boards, or 20% for Class 1. That sure looks like more than 10% to me... Kind regards, Steve Gregory Production Engineer OAI Electronics 6960 East 12th Street Tulsa, Oklahoma 74112 (918) 836-9077 ext 507 (918) 836-0184 FAX -----Original Message----- From: Kane, Amol (349) [mailto:[log in to unmask]] Sent: Tuesday, August 07, 2007 6:52 AM To: Steve Gregory Subject: RE: [TN] Dent on BGA Pad Thanks Steve, here it is Amol S. Kane Process Engineer Harvard Custom Manufacturing 941 Route 38 Owego, NY 13827 Phone: 607-687-7669 Ext. 349 Fax: 607-687-9733 Email: [log in to unmask] -----Original Message----- From: Steve Gregory [mailto:[log in to unmask]] Sent: Tuesday, August 07, 2007 7:49 AM To: Kane, Amol (349) Subject: RE: [TN] Dent on BGA Pad Good Morning Amol! Just go ahead and send it to me and I'll post it for you, then send you a link to the photo. Kind regards, Steve -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Amol (349) Sent: Tuesday, August 07, 2007 6:42 AM To: [log in to unmask] Subject: [TN] Dent on BGA Pad Dear Technetters, Lately, we have been receiving bare boards from our supplier with some dents on the BGA Pads (ENIG Finish). The dent is plated too (no exposed Ni). What kinds of assembly defects can potentially be associated with this condition? (voiding and coplanarity post reflow comes to mind). Are there any specs that cover this kind of condition/defect? I want to reject this board but need something to stand by I am sure that somebody else has seen this too, how was this dealt with? Steve: I wish to post a picture of this condition, can you please direct me how to do it? Thanks in advance, Amol ------------ CONFIDENTIALITY NOTICE: This e-mail, and any attachments, is for the sole use of the intended recipient(s) and may contain information that is confidential and protected from disclosure under the law. Any unauthorized review, use, disclosure, or distribution is prohibited. If you are not the intended recipient, please contact the sender by reply e-mail, and delete/destroy all copies of the original message and attachments. 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Any unauthorized review, use, disclosure, or distribution is prohibited. If you are not the intended recipient, please contact the sender by reply e-mail, and delete/destroy all copies of the original message and attachments. Thank you. CONFIDENTIALITY NOTICE: This e-mail, and any attachments, is for the sole use of the intended recipient(s) and may contain information that is confidential and protected from disclosure under the law. Any unauthorized review, use, disclosure, or distribution is prohibited. If you are not the intended recipient, please contact the sender by reply e-mail, and delete/destroy all copies of the original message and attachments. Thank you. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------