To add to your point, I've already seen customer complaints, who with their hand held XRF, have found lead in the lead oxide of the glass frit encapsulation of resistors...so we will use a different supplier who doesn't have lead oxide :( And they have found Cr on the plated surface of caps. Cr is commonly confused with Antimony if one isn't careful with the analysis, but apparently Cr3 is used somewhere in the plating on caps. So we will get it eliminated :( Can you see my head hanging low? -Ryan -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke Sent: Wednesday, August 15, 2007 11:17 AM To: [log in to unmask] Subject: Re: [TN] Does encapsulation make a part RoHS compliant? Bit academic in this case, the material in question is almost certainly the die attach solder which has been intentionally added. Not sure if the matter has ever gotten into court which would be the place to resolve it.....8-) John Burke (408) 515 4992 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Ryan Grant Sent: Wednesday, August 15, 2007 10:04 AM To: [log in to unmask] Subject: Re: [TN] Does encapsulation make a part RoHS compliant? Was the definition of "homogenous" ever finally decided? As I understand, there was some debate because "homogenous" was defined as 'able to be mechanically separated'. I've never really been successful at mechanically separating an encapsulation from a substrate, but chemical separation works well! Nor have I been successful at mechanically separating resin from glass or plating from a base metal, etc. (I bring this up because I'm being asked to chase down independent lab analysis at the chemical declaration sheet level because of the "homogenous" term) -Ryan -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke Sent: Wednesday, August 15, 2007 10:47 AM To: [log in to unmask] Subject: Re: [TN] Does encapsulation make a part RoHS compliant? It would still be non compliant the limits are for homogenous material not for the assembly. John John Burke (408) 515 4992 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Lenny Carter Sent: Wednesday, August 15, 2007 10:10 AM To: [log in to unmask] Subject: Re: [TN] Does encapsulation make a part RoHS compliant? Encapsulation will not make the COMPONENTS ROHS compliant, but maybe the ASSEMBLY ROHS compliant as it is my understanding that the ROHS compliancy is based on mass (or weight) of the assembly in question. Encapsulating the assy will greatly increase the weight of it and therefore decrease the % of lead in the assembly based on it's weight. Just a different perspective. Lenny Carter Design Engineer ERG, Inc. www.ergpower.com ----- Original Message ----- From: "Eric CHRISTISON" <[log in to unmask]> To: <[log in to unmask]> Sent: Wednesday, August 15, 2007 9:59 AM Subject: Re: [TN] Does encapsulation make a part RoHS compliant? > As fas as I'm aware encapsulation doesn't make a product ROHS compliant. > > Phil Nutting wrote: >> Good morning, >> >> We have a component that in the PTH form is RoHS compliant, but the SMT >> is not. The manufacturer states that it has to do with thermal >> performance of the D2PAK. It has been suggested that if we encapsulated >> the part it would become RoHS compliant. >> >> I have two issues with this; 1) difficulty of encapsulating a single >> part on a circuit board after reflow assembly and conformal coating does >> not count, and 2) I don't believe simply encapsulating the part will >> make it comply with the requirements of RoHS. >> >> We would like to avoid redesigning the board for the PTH part. >> >> Am I correct in my assumption that encapsulation does not make a part >> RoHS compliant? >> >> Any suggestions for a solution? >> >> Thanks in advance. >> >> Phil Nutting >> Design for Manufacturing Engineer >> Kaiser Systems, Inc. >> 126 Sohier Road >> Beverly, MA 01915 >> voice: 978-922-9300 x1310 >> fax: 978-922-8374 >> e-mail: [log in to unmask] www.kaisersystems.com >> >> --------------------------------------------------- >> Technet Mail List provided as a service by IPC using LISTSERV 15.0 >> To unsubscribe, send a message to [log in to unmask] with following text in >> the BODY (NOT the subject field): SIGNOFF Technet >> To temporarily halt or (re-start) delivery of Technet send e-mail to >> [log in to unmask]: SET Technet NOMAIL or (MAIL) >> To receive ONE mailing per day of all the posts: send e-mail to >> [log in to unmask]: SET Technet Digest >> Search the archives of previous posts at: >> http://listserv.ipc.org/archives >> Please visit IPC web site >> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional >> information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 >> ext.2815 >> ----------------------------------------------------- >> >> > > -- > Eric Christison Msc > Mechanical Engineer > Home Personal, Communication Sector > Imaging Division > > STMicroelectronics (R&D) Ltd > 33 Pinkhill > Edinburgh EH12 7BF > United Kingdom > > Tel: +44 (0)131 336 6165 > Fax: + 44 (0)131 336 6001 > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using 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----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] 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