Dear All, We are getting Large voids in Micro BGA on someof the pads having PTH/via (greater than 40% in dia) after reflow soldering in one of our multi layer PCB. We are using ROHS paste and ROHS component. Can I know what may be the reason for these voids Regards SHANKAR K. Shankar Rao --------------------------------- Unlimited freedom, unlimited storage. Get it now --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------