This may seem a little obvious, but I always do that profiling by drilling into the component using a dental drill. While writing, I have noticed a number of people having problems with lead free on 0201 components. I put this down to the higher temperature running out the flux activity due to the tiny amount of solder paste. Obviously nitrogen would help with this but was just wondering if anyone else was seeing issues, as I have also seen issues with a 0.5 MM BGA device. Anyone out there have any comments?? John John Burke (408) 515 4992 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of David Tremmel Sent: Thursday, July 26, 2007 2:22 PM To: [log in to unmask] Subject: [TN] microBGA rework Hello gurus of the Technet, We are trying to rework some microBGAs but there is not enough room under the parts for a thermocouple and drilling a hole through the board is not an option at this point. We are placing a thermocouple on the top of the components being reworked and covering it with Kapton tape and the thermal profile we are using is maxing-out at 215° C. Does anyone have experience measuring the component temperature and not the solder temperature and would they mind sharing their results? Are we asking for field defects because we are not measuring the solder temperature? Thank you in advance, David Tremmel (847) 858-5540 - Cell --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------