just ..THANK YOU Ivan >Karen/all > >Doug Pauls of Rockwell-Collins put together a few papers about cleaning and >residues. Anyone can download from >http://files.ipc.org/cleaning_papers.zip > >This zip file is about 4 MB. Be sure to right click the link and "Save target >as..." or you'll probably get an error msg. > >Jack > >Jack Crawford, IOM IPC Director Certification and Assembly Technology >[log in to unmask] >847-597-2893 >FAX 847-615-5693 >3000 Lakeside Drive, Suite 309 S >Bannockburn, IL, 60015 > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]] On Behalf Of Karen Ebner >Sent: Thursday, July 12, 2007 7:35 AM >To: [log in to unmask] >Subject: Re: [TN] Dull SnPb solder joints > >That would be great! > >If Brian would forward me his papers too I would appreciate that. > >[log in to unmask] 07/12/2007 08:18 AM > >To >TechNet E-Mail Forum <[log in to unmask]>, Karen Ebner ><[log in to unmask]> cc > >Subject >Re: [TN] Dull SnPb solder joints > >Hi Karen - Doug is on vacation but he should be able to recommend a couple of >reference sources for "white residue" upon his return. Hey >Brian! What do you recommend as a good reference for the white residue >question? >Dennis Bernier, Kester Solder, published a good paper on white residue >causes and I'll see if I can find it in my files. > >Dave > >Karen Ebner <[log in to unmask]> Sent by: TechNet <[log in to unmask]> >07/11/2007 08:57 AM > >Please respond to >TechNet E-Mail Forum <[log in to unmask]>; Please respond to Karen Ebner ><[log in to unmask]> > >To >[log in to unmask] >cc > >Subject >Re: [TN] Dull SnPb solder joints > >Hi David > >How do I get hold of Brian Ellis and Doug Pauls papers? > >Please advise. > >"David D. Hillman" <[log in to unmask]> Sent by: TechNet ><[log in to unmask]> >07/11/2007 09:19 AM >Please respond to >TechNet E-Mail Forum <[log in to unmask]>; Please respond to >[log in to unmask] > >To >[log in to unmask] >cc > >Subject >Re: [TN] Dull SnPb solder joints > >Hi Jon - yes, potentially the same etching impact can give a slightly white >appearance. Can you tell if there is a physical residue that is >causing the slightly white appearance? Or do you just have a metal >surface? White residues on pwas are pretty common and are typically >associated with a cleaning process which is too hot resulting in rosin >and > >/or metal oxides that are contained in flux residues to be transformed into an >insoluble lacquer coating on the pwa. Brian Ellis and Doug Pauls > >have both documented numerous white residue issues resulting from improper > >cleaning of flux residues. An etching situation typically looks gray or blueish >as the removal of tin from the solder joint surface leaves lead >which tends to give a dark visual appearance. > >Dave > >"Roberts, Jon" <[log in to unmask]> 07/11/2007 08:10 AM > >To >"TechNet E-Mail Forum" <[log in to unmask]>, <[log in to unmask]> >cc > >Subject >RE: [TN] Dull SnPb solder joints > >David, Question, we have seen solder joints that have a dull appearance but also >exhibit having slightly white appearance. Could the cause >mentioned in these emails have could cause what we have seen >periodically? Jon > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman >Sent: Wednesday, July 11, 2007 7:39 AM >To: [log in to unmask] >Subject: Re: [TN] Dull SnPb solder joints > >Hi folks! I can add some additional detail to Guy's observations. The dull >solder joint appearance that Guy correlated to the fresh DI beds is a >result of the solder joint surfaces being slightly etched. The "fresh DI > >beds" result in a water pH that is slightly more acidic in nature than "old DI >beds". This change in water pH results in a preferential etch of > >the tin in the tin/lead solder joint surfaces thus the dull visual appearance. >A number of years ago, I ran into a situation where a number > >of printed wiring assemblies had been subjected to an excess number of >saponified cleaning cycles. The solder joints surfaces were soo etched >that the pwas looked "purple" - we dubbed the pwas "Barney boards" in >honor of the purple dinosaur cartoon show! This dull solder joint >discussion again demonstrates the visual appearance has very little to >do >with the overall solder joint integrity. > >Dave Hillman >Rockwell Collins >[log in to unmask] > >Guy Ramsey <[log in to unmask]> >Sent by: TechNet <[log in to unmask]> >07/10/2007 09:10 AM >Please respond to >[log in to unmask] > >To >[log in to unmask] >cc > >Subject >Re: [TN] Dull SnPb solder joints > >With fresh DI beds we get duller joints for a day or two. It was more pronounced >with the flux formula we used a year ago. We switched to get >better control of the foam fluxer and got shiner joints, more like the >joints from our reflow process. > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Amol (349) >Sent: Tuesday, July 10, 2007 9:22 AM >To: [log in to unmask] >Subject: [TN] Dull SnPb solder joints > >Dear Technetters, >We are seeing dull SMT solder joints near some TH parts that go over the >wave. The board top side temp is getting to 110C. using OA flux at wave >and >SMT. The boards are immediately put thru an aqueous wash. The SMT joints >were shiny coming out of SMT. The customer is noticing this because >other >areas of the board (except near the TH parts) look shiny. >There are no residues on the joints as I tried to manually clean a joint >with water and IPA and did not have any flux residue on the Q-tip. > >Has anybody else noticed this phenomenon?......the only literature I could >find on dull SnPb joints says the dull appearance could be due to a >"cold" >joint, which I know is not the case. Even though this is not a defect I >want >to know the reason for this to happen. > >Could the wave flux cause this issue? > >Amol > >-----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of >Bev Christian >Sent: Tuesday, July 10, 2007 8:19 AM >To: [log in to unmask] >Subject: Re: [TN] Injury by array > >Jeff, >Two other possibilities (both costing $) are: >1) automatic board handler >2) gloves > >I don't like either one, but there they are. >Bev >RIM > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]] On Behalf Of McGlaughlin, Jeffrey >A >Sent: Tuesday, July 10, 2007 7:23 AM >To: [log in to unmask] >Subject: [TN] Injury by array > >Oh wise and wonderful members of tech net - > >We have had to incidents in the past six months where assemblers have been >cut while handling assembly arrays (2-up panels) for one of our >products. >This has elevated the issue to "Panic Mode" due to the involvement of >EHS&Q >(environmental health, safety and quality). As the designer of the array >I >have been given ownership of the issue and am task with resolving it. >After >20+years of handling boards and arrays I have never been cut, so I am >unsure >as to what if any corrective action can be taken to prevent future >injuries. > >The specifics on the arrays - >10.5" [267mm] x 12.0" [305mm] x 0.062" [1.6mm] thick >2 - up for 4.7"[119.3mm] x 9.2" [233.6mm] PCB Minimum rail 0.38"[9.5mm] >Tab >Route and Retain (mouse bite) Injuries occurred during loading of the >solder >printer and during slide line operations for post reflow assembly. > >Any suggestions on what to tell our production group? > >Jeffrey McGlaughlin, CID Engineering Designer >Battelle >505 King Avenue >Columbus Ohio 43201-2693 >(614)424-7582 Phone >(614)458-7582 Fax >PS Don't you just love all those management buzzwords (underlined.) >>;-D > >--------------------------------------------------- >Technet Mail List provided as a service by IPC using LISTSERV 15.0 To >unsubscribe, send a message to [log in to unmask] with following text in >the >BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or >(re-start) delivery of Technet send e-mail to >[log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing >per >day of all the posts: send e-mail to >[log in to unmask]: SET Technet Digest >Search the archives of previous posts at: >http://listserv.ipc.org/archives >Please visit IPC web site >http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional >information, >or contact Keach Sasamori at [log in to unmask] or 847-615-7100 >ext.2815 >----------------------------------------------------- > >--------------------------------------------------------------------- This >transmission (including any attachments) may contain confidential >information, privileged material (including material protected by the >solicitor-client or other applicable privileges), or constitute >non-public >information. 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