Hi:
Solderbar suppliers have
the test equipment to perform solderpot solder analysis. You can check your
solderbar supplier whether they can perform the solder analysis for you, as a
service, else you can send to test labs to perform alloy composition, with dry
or wet methods. Sample size of solder will vary, depending on the test method. We
recommend users to check solderpot composition regularly, say 3 mths to 6 mths
periodically, to monitor the impurities as well as copper content. It is better
to capture the copper increase right at moderate level, rather than when it is
at very high level, where it might be more tedious to dilute then. Correcting
the solderpot composition per element is easy, based on the simple mathematics.
For example, when 2
different tin-lead alloys are combined, the total mass is
M(total) = M1 + M1
If alloy 1 has a tin
percentage of m1, etc, the tin percentage after combination will be:
m(tin) = (m1M1 +
m2M2)/(M1 + M2)
You can obtain the alloy
composition by working out individual elements with this approach.
Any further questions, pls
let me know.
Best regards,
Christine Poon
Kester
From:
TGAsia [mailto:
Sent: Friday, June 15, 2007 10:46
AM
To: [log in to unmask]
Subject: Re: [TGA] 关于焊锡成分分析
Dear Friend,
Yes, J-STD-006 is
suitable. And QQ-S-571, JIS Z 3282, IEC/ISO-9453 also defined chemical
composition and forms for impurity in solder alloy.
Kind Regards
Peter Deng
==================================
Reliability & Failure Analysis Lab
Electrical & Electronic Division,
SGS-CSTC
Office: 0755-2671 0624
Website: www.cn.sgs.com;
www.sgs.com
From:
TGAsia [mailto:
Sent: 2007年6月15日
10:02
To: [log in to unmask]
Subject: Re: [TGA] 关于焊锡成分分析
PangMin,
Here are the requirements
from IPC-J-STD 006:
3.3 Alloy
Impurities Elements
not listed as components that make up the composition
of an alloy are considered impurities for
that alloy. An alloy variation designator shall be used to specify the
allowable impurity level of a solder product
being offered, in the case of a manufacturer; or the allowable impurity
level of a solder product required, in the case of a user. The alloy variation
designator will be added to the end of the
alloy name and become part of the name (see 6.3).
NOTE: Alloys for barrier-free die attachment
applications have a different alloy impurity
requirement (see 3.3.1).
Unless otherwise specified, the percentage by mass of impurity elements in alloys shall not exceed the following values.
The percentage by mass of impurity elements in variation D alloys shall conform
to the requirements in
3.3.1. |
|
|
Ag: 0.10 |
Cd: 0.002 |
Pb: 0.10 |
Al: 0.005 |
Cu: 0.08 |
Sn: 0.25 |
As: 0.03 |
Fe: 0.02 |
Zn: 0.003 |
Au: 0.05 |
In: 0.10 |
Sb: 0.05 |
Bi: 0.10 |
Ni: 0.01 |
|
The
mass percentage of each element in an alloy shall be determined by any standard analytical procedure.
Wet chemistry shall be used as the referee procedure.
Best Regards,
Mobile: +86 159 7693 5620
e-mail:
[log in to unmask]
"Creating Value that Increases Customer
Competitiveness"
From:
TGAsia [mailto:
Sent: Friday, June 15, 2007 9:25
AM
To: [log in to unmask]
Subject: [TGA] 关于焊锡成分分析
诸位,早上好:
向大家咨询一个关于焊锡的金属元素分析的问题。
各位是否知道,根据什么标准,对波峰焊的锡池内的焊锡的金属元素都包含什么金属元素?
标准是多少?在哪里可以检测到这些金属元素的成分?我公司内用的焊锡Sn/Pb比例为63/37。
或者,在您所在的公司内关于这项内容是如何控制的呢?
thanks a lot.
Best Regards!
Pang Min (Ms.) 庞敏
SV CGQ Quality Department
Siemens VDO Automotive
1981,
130033
Tel: +86 431 84684557
Fax:+86 431 84684586
mailto:[log in to unmask]
[log in to unmask]
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