Hello all,

Here is a SIP (System in Package) with high lead (>95%) solder bump and 63/37 soldering on the Flip Chip.

Any study on implement NSMD to C4? Seems J-STD-012 does not define the land pattern. Is it still applicable for C4 that NSMD has 70% life improvement which defined in IPC-7095A?

Please comment. Thanks.

Best regards,

Johnny

- Process Engineering

Creating Value That Increases Customer Competitiveness

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