感谢谭建刚, Rambo, Jiazhongzhong! 

请问这个问题在IPC哪个标准里有体现? 

谢谢
Lilyzhu

---- Original Message ----- 
From: <[log in to unmask]>
To: "Asia Committe Task Group Forum" <[log in to unmask]>; "Lily Zhu" <[log in to unmask]>
Sent: Tuesday, June 26, 2007 3:25 PM
Subject: 答复: [TGA] DFM 请教


> 孔比引线大0.2~0.4mm。
> 
> 

----- Original Message ----- 
From: Rambo Li 
To: [log in to unmask] 
Sent: Tuesday, June 26, 2007 3:40 PM
Subject: Re: [TGA] DFM 请教



1:1.2   Perfect
----- Original Message ----- 
From: "Jiangang.tan" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, June 26, 2007 3:34 PM
Subject: 答复: [TGA] DFM 请教


> Lily,
>   我以前在Flextronics X-BOX项目工作时也碰到过这个问题, X-BOX主板上面有几个
> 电感线圈老是因为松动导致翘高,针对这个问题后来改善夹具把问题解决啦.
>  爬锡问题,你可以尝试去适当的调高预热温度看看怎样.另外,你的波峰焊有两个波峰
> 吗?你可以开两个波峰实验一下.
>  
> Thanks & best regards,
> ------------------------------------------------
> Jude.Tam/谭建刚
> Ramaxel Technology Limited
> Tel：+86 755 26833203
> Fax：+86 755 26831731
> Email:[log in to unmask]
> ------------------------------------------------
> Creating Value That Increases Our Customer's Competitiveness
> 
> -----邮件原件-----
> 发件人: TGAsia [mailto:[log in to unmask]] 代表 Lily Zhu
> 发送时间: 2007年6月26日 15:21
> 收件人: [log in to unmask]
> 主题: [TGA] DFM 请教
> 
> 各位,
> 
> 请教一下, PCBA板中通孔的直径和安放在通孔里的元器件引脚的直径比例在一个怎样的
> 范围比较好?
> 
> 现在遇到一个问题, 元件的引脚比较细, 过波峰焊后焊锡在通孔里爬升情况不好, 摇一
> 摇元件身体部分, 引脚就会松动. 在更换了活性较强的助焊剂后, 情况不见好转. 
> 
> 欢迎各位大侠出谋划策, 谢谢!
> Lilyzhu
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