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Subject: Re: [TGA] Do you know which IPC define hole and lead ratio for wave soldering
Date: Wed, 16 May 2007 22:37:41 +0800
Message-ID: A<[log in to unmask]>
In-Reply-To:  A<[log in to unmask]>
Thread-Topic: [TGA] Do you know which IPC define hole and lead ratio for wave              soldering
thread-index: AceGJWwOQb7CtR/fQGWT4pTkS/0w7gRlXxagAALS6LA=
References:  <[log in to unmask]>                      A<[log in to unmask]>             A<[log in to unmask]>
From: "David Bergman" <[log in to unmask]>
Sender: "TGAsia" <[log in to unmask]>
To: <[log in to unmask]>
Reply-To: "Asia Committe Task Group Forum" <[log in to unmask]>,
	"David Bergman" <[log in to unmask]>


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Hi Xiaoping, welcome to TGAsia list.
=20
The IPC spec is IPC-2222 (Table 9-3).  There are three levels so there =
is a bit of a range.  Worst case is 0.7mm maximum hole over minimum =
lead.  Least case is 0.15mm hole over lead. =20
=20
Hope this helps.
=20

Best regards,=20
Dave=20


David W. Bergman, CAE=20
Vice President, Standards, Technology and International Relations=20
IPC=20
3000 Lakeside Drive # 309S=20
Bannockburn, IL 60015=20
Phone 847-597-2840 Fax 847-615-5640=20
Mobile 847-867-1388=20
Main 847-615-7100=20
email [log in to unmask]       <http://www.ipc.org/> www.ipc.org=20

=20

  _____ =20

From: TGAsia [mailto:[log in to unmask]] On Behalf Of Xiaoping Chen
Sent: Wednesday, May 16, 2007 8:36 AM
To: [log in to unmask]
Subject: [TGA] Do you know which IPC define hole and lead ratio for wave =
soldering



Hi Chris,

=20

I'm Xiaoping Chen from Flex DG process Engineering, my team focus on =
NPI. Many works such as DFM, FMEA need to be prepared and sent to =
customer for review. But I always questioned by customer for wave =
soldering. Do you know which IPC define PCB hole and component lead =
ratio? What's the relationship between lead length and lead pitch of =
connector?=20

=20

Wish I can get your advice.

=20

Rgds...Xiaoping

=20

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<DIV dir=3Dltr align=3Dleft><FONT face=3DArial color=3D#0000ff =
size=3D2><SPAN=20
class=3D924332614-16052007>Hi Xiaoping, welcome to TGAsia=20
list.</SPAN></FONT></DIV>
<DIV dir=3Dltr align=3Dleft><FONT face=3DArial color=3D#0000ff =
size=3D2><SPAN=20
class=3D924332614-16052007></SPAN></FONT>&nbsp;</DIV>
<DIV dir=3Dltr align=3Dleft><FONT face=3DArial color=3D#0000ff =
size=3D2><SPAN=20
class=3D924332614-16052007>The IPC spec is IPC-2222 (Table 9-3).&nbsp; =
There are=20
three levels so there is a bit of a range.&nbsp; Worst case is 0.7mm =
maximum=20
hole over minimum lead.&nbsp; Least case is 0.15mm hole over lead.&nbsp; =

</SPAN></FONT></DIV>
<DIV dir=3Dltr align=3Dleft><FONT face=3DArial color=3D#0000ff =
size=3D2><SPAN=20
class=3D924332614-16052007></SPAN></FONT>&nbsp;</DIV>
<DIV dir=3Dltr align=3Dleft><FONT face=3DArial color=3D#0000ff =
size=3D2><SPAN=20
class=3D924332614-16052007>Hope this helps.</SPAN></FONT></DIV>
<DIV>&nbsp;</DIV><!-- Converted from text/rtf format -->
<P><FONT face=3DArial size=3D2>Best regards,</FONT> <BR><FONT =
face=3DArial=20
size=3D2>Dave</FONT> </P><BR>
<P><FONT face=3DArial size=3D2>David W. Bergman, CAE</FONT> <BR><FONT =
face=3DArial=20
size=3D2>Vice President, Standards, Technology and International =
Relations</FONT>=20
<BR><FONT face=3DArial size=3D2>IPC</FONT> <BR><FONT face=3DArial =
size=3D2>3000 Lakeside=20
Drive # 309S</FONT> <BR><FONT face=3DArial size=3D2>Bannockburn, IL =
60015</FONT>=20
<BR><SPAN lang=3Dfr><FONT face=3DArial size=3D2>Phone 847-597-2840 Fax=20
847-615-5640</FONT></SPAN> <BR><SPAN lang=3Dfr><FONT face=3DArial =
size=3D2>Mobile=20
847-867-1388</FONT></SPAN> <BR><SPAN lang=3Dfr><FONT face=3DArial =
size=3D2>Main=20
847-615-7100</FONT></SPAN> <BR><SPAN lang=3Dfr><FONT face=3DArial =
size=3D2>email=20
[log in to unmask]&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; </FONT></SPAN><A=20
href=3D"http://www.ipc.org/"><SPAN lang=3Dfr><U><FONT face=3DArial =
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<HR tabIndex=3D-1>
<FONT face=3DTahoma size=3D2><B>From:</B> TGAsia [mailto:[log in to unmask]] =
<B>On=20
Behalf Of </B>Xiaoping Chen<BR><B>Sent:</B> Wednesday, May 16, 2007 8:36 =

AM<BR><B>To:</B> [log in to unmask]<BR><B>Subject:</B> [TGA] Do you know =
which IPC=20
define hole and lead ratio for wave soldering<BR></FONT><BR></DIV>
<DIV></DIV>
<DIV class=3DSection1>
<P class=3DMsoNormal><FONT face=3DArial color=3Dnavy size=3D1><SPAN =
lang=3DEN-US=20
style=3D"FONT-SIZE: 9pt; COLOR: navy; FONT-FAMILY: Arial">Hi=20
Chris,<o:p></o:p></SPAN></FONT></P>
<P class=3DMsoNormal><FONT face=3DArial color=3Dnavy size=3D1><SPAN =
lang=3DEN-US=20
style=3D"FONT-SIZE: 9pt; COLOR: navy; FONT-FAMILY: =
Arial"><o:p>&nbsp;</o:p></SPAN></FONT></P>
<P class=3DMsoNormal><FONT face=3DArial color=3Dnavy size=3D1><SPAN =
lang=3DEN-US=20
style=3D"FONT-SIZE: 9pt; COLOR: navy; FONT-FAMILY: Arial">I&#8217;m =
Xiaoping Chen from=20
Flex DG process Engineering, my team focus on NPI. Many works such as =
DFM, FMEA=20
need to be prepared and sent to customer for review. But I always =
questioned by=20
customer for wave soldering. Do you know which IPC define PCB hole and =
component=20
lead ratio? What&#8217;s the relationship between lead length and lead =
pitch of=20
connector? <o:p></o:p></SPAN></FONT></P>
<P class=3DMsoNormal><FONT face=3DArial color=3Dnavy size=3D1><SPAN =
lang=3DEN-US=20
style=3D"FONT-SIZE: 9pt; COLOR: navy; FONT-FAMILY: =
Arial"><o:p>&nbsp;</o:p></SPAN></FONT></P>
<P class=3DMsoNormal><FONT face=3DArial color=3Dnavy size=3D1><SPAN =
lang=3DEN-US=20
style=3D"FONT-SIZE: 9pt; COLOR: navy; FONT-FAMILY: Arial">Wish I can get =
your=20
advice.<o:p></o:p></SPAN></FONT></P>
<P class=3DMsoNormal><FONT face=3DArial color=3Dnavy size=3D1><SPAN =
lang=3DEN-US=20
style=3D"FONT-SIZE: 9pt; COLOR: navy; FONT-FAMILY: =
Arial"><o:p>&nbsp;</o:p></SPAN></FONT></P>
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lang=3DEN-US=20
style=3D"FONT-SIZE: 9pt; COLOR: navy; FONT-FAMILY: =
Arial">Rgds&#8230;Xiaoping<o:p></o:p></SPAN></FONT></P>
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lang=3DEN-US=20
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