Like an old Classic Car, who also is not uncomfortable with its bias plies. Dewey -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M. Sent: Friday, June 29, 2007 11:43 AM To: [log in to unmask] Subject: Re: [TN] - Immersion Silver Bias As you are well aware from our many Dear "Doctor Uncomortable", As you are well aware from our many years of work together in the Bell System (Western Electric, AT&T, Bell Laboratories, Lucent Techechnology)I am extremely biased towards the use of immersion silver surface finish. We do have at least one simple legacy product using ENIG that doesn't make sense to convert. However, my preference is not to use ENIG whenever possible. I don't sell immersion surface finish chemistry or own any stock in companies who sell chemistry or fabricate PCB's. However, I've spent the better part of the past 40 years addressing solder joint issues in manufacturing as well as doing failure analysis on customer returns. My bias is based on the number of ENIG failures I've seen and the lack of immersion silver issues I've seen. During the past eleven years I have not see any solder joint failures due to the use of immersion silver surface finish. You on the other hand like our other friend Werner may have your own biases but I know from the many TN posting that you, Werner, as well as other consultants post continue to work with customers who have ENIG surface finish issues. I'm also aware of failure analysis labs who stay in business because they are continually addressing ENIG failures for their clients. Fortunately, I'm not uncomfortable with my bias. Regards, George George M. Wenger Senior Principle FMA / Reliability Engineer Andrew Corporation Wireless Network Solutions Group 40 Technology Drive, Warren, NJ 07059 (908) 546-4531 (office) (732) 309-8964 (cell) -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee parker Sent: Friday, June 29, 2007 1:39 PM To: [log in to unmask] Subject: [TN] Steve I have been involved with ENIG failures since '98. The quality of the ENIG chemistry has improved tremendously since then, but I continue to move customers from ENIG to other alternatives. Most of this is caused by black pad. The problem is that black pad often requires months to develop and I have not found a reliable test to be used immediately after fabrication to predict whether on not the coating will be black pad prone. Consequently, I am very uncomfortable with ENIG. Best regards Lee J. Lee Parker, Ph.D. JLP Consultants LLC 804 779 3389 ----- Original Message ----- From: "Steve Kelly" <[log in to unmask]> To: <[log in to unmask]> Sent: Friday, June 29, 2007 10:42 AM Subject: [TN] > Good Morning to All, > > I have a customer who has asked me to do an on-going test for black pad. > The > test would require me to solder wires onto 624 BGA pads and then pull on > the > wires to determine if there is black pad . They have given me no criteria > in > terms of pull strength or what constitutes pass/fail. I obviously need > some > kind of pull tester to do this. Has anyone done anything similar? Any > thoughts or ideas would be appreciated. Regards Steve Kelly > > > > Steve Kelly > > (416) 750-8433 (work) > > (416) 750-0016 (fax) > > (416) 577-8433 (cell) > > > > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ------------------------------------------------------------------------ ------------------------ This message is for the designated recipient only and may contain privileged, proprietary, or otherwise private information. 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