I agree in principle with Dewey... We do reflow-shear testing to determine acceptability of PCBs.... This technique captures both the as-manufactured condition of the PCB and design issues as they relate to the solder joint strength...It provides a relatively direct measure of the ratio of the strength of the solder joint to the bulk solder strength which is the measure of a good bonded joint... A solder and pull has too many additional variables to separate from the joint shear data and the process typically does not stress the joint in the same way as BGA ball failures occur... Paul Edwards Process/Quality Engineering [log in to unmask] Tel: 408-433-4700 FAX: 408-433-9988 Surface Art Engineering 81Bonaventura Dr. San Jose, CA 95134 DUNS: 944740570 CAGE/NCAGE: 1XZ48 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey (EHCOE) Sent: Friday, June 29, 2007 9:47 AM To: [log in to unmask] Subject: [TN] Part of me wants to say that is shear lunacy. I would suggest reflowing solder balls to the pads and due a pull/shear test. There are several test reports and Equipment people that could help you with this. The goal would be to have a cohesive failure of the solder ball. All that does is establish, regardless of the undefined anomaly, that an acceptable adhesion can be attained at the ball/pad interface. Dewey -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Kelly Sent: Friday, June 29, 2007 7:42 AM To: [log in to unmask] Subject: [TN] Good Morning to All, I have a customer who has asked me to do an on-going test for black pad. The test would require me to solder wires onto 624 BGA pads and then pull on the wires to determine if there is black pad . They have given me no criteria in terms of pull strength or what constitutes pass/fail. I obviously need some kind of pull tester to do this. Has anyone done anything similar? Any thoughts or ideas would be appreciated. Regards Steve Kelly Steve Kelly (416) 750-8433 (work) (416) 750-0016 (fax) (416) 577-8433 (cell) --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------