Part of me wants to say that is shear lunacy. I would suggest reflowing solder balls to the pads and due a pull/shear test. There are several test reports and Equipment people that could help you with this. The goal would be to have a cohesive failure of the solder ball. All that does is establish, regardless of the undefined anomaly, that an acceptable adhesion can be attained at the ball/pad interface. Dewey -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Kelly Sent: Friday, June 29, 2007 7:42 AM To: [log in to unmask] Subject: [TN] Good Morning to All, I have a customer who has asked me to do an on-going test for black pad. The test would require me to solder wires onto 624 BGA pads and then pull on the wires to determine if there is black pad . They have given me no criteria in terms of pull strength or what constitutes pass/fail. I obviously need some kind of pull tester to do this. Has anyone done anything similar? Any thoughts or ideas would be appreciated. Regards Steve Kelly Steve Kelly (416) 750-8433 (work) (416) 750-0016 (fax) (416) 577-8433 (cell) --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------