不是,

 

外层是贯穿整个PCB厚度两面的的意思,内层多用于多层板中的内部结构层内。与covelay covercoat 覆盖不覆盖没关系的。

 

Best regards,

Laya Chen  陈燕

Microtek (Changzhou) Laboratories

Tel: +86 519 5487805

Cell: +86 13115289328

Fax: +86 519 5487810

Email: [log in to unmask]


发件人: Angela [mailto:[log in to unmask]]
发送时间: 2007年5月11 9:42
收件人: Laya Chen; Asia Committe Task Group Forum
主题: Re: 答复: [TGA] [***SPAM*** Score/Req: 08.30/05.00]答复: [TGA] 请教专业术语问题

 

Dear Laya

 

  对于外层和内层的区别,外层就是没有被CoverlayCovercoat覆盖的,内层就是被埋在CoverlayCovercoat里的对吗?

 

  Best regards!
     
2007-05-11
Angela
Marketing Dept.
Suiwa High Technology Electric Industries(Xiamen)Co.Ltd
Tel
0592-5905789
Mobile Tel
13459205246
Fax
0592-5905790
Email
[log in to unmask]
website
www.swflex.com
Address
NO.1776,lvling Road,Xiamen,Fujian,China.


Addresser Laya Chen

Time 2007-05-11 09:31:07

Addressee Asia Committe Task Group Forum; Angela

cc

Subject 答复: [TGA] [***SPAM*** Score/Req: 08.30/05.00]答复: [TGA] 请教专业术语问题

 

Angela 你好

 

 真正从术语翻译角度来讲的话,可能用“外层镀通孔”、“内层镀通孔”和“外层非支撑孔”比较合适,意思还是下面的意思,但是这样讲可能比较不容易产生误解。

 

External plated through holes---外层镀通孔,贯穿整个PCB厚度的铜镀孔,可为电路互连用的金属通孔,也可为用于Component Mounting( 元件安装) 用的金属通孔

Internal plated through holes---内层镀通孔,即为Buried Via,即金属导通埋孔,孔内有铜镀层

External unsupported holes---外层非支撑孔,即为孔内无镀层的元件安装孔(component mounting holes w/o copper plating through entire PCB

 

 

Best regards!
     
Best regards,

Laya Chen  陈燕

Microtek (Changzhou) Laboratories

Tel: +86 519 5487805

Cell: +86 13115289328

Fax: +86 519 5487810

Email: [log in to unmask]