Dummy pad 用于PCB 制造过程中,

用于内层: 是为了防止PCB板压合后出现部分压合厚度不均匀导致PCB 变形或层于层粘合力不足。
用于外层: 是考虑到线路上电镀铜厚度,如果空旷区域很大,导致周围线路导线增粗,增厚, 此时应在空旷区域添加一些dummy pard 来平衡周围的铜离子,



JiaXing LIU <[log in to unmask]>
Sent by: TGAsia <[log in to unmask]>

05/15/2007 05:32 PM

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Re: [TGA] 答复: Re: [TGA] acti ve pad and  dummy pad





Sometimes also leave some pads on non-circuit area of external lay of PCB for plating current uniformity, so that can reduce PTH copper thickness  difference in different holes.

no special chinese name for dummy pad in this case. same meaning as false pad.



Best reagrds

Jason Liu
Asia Pacific Strategic Sourcing
SDE

TRW Systems Consulting Services(Shanghai) Co., Ltd.
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Shanghai 200233, P.R.China
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>>> Bob Neves <[log in to unmask]> 2007-5-15 17:04:42 >>>
Hello All,



In the plated through hole of a multi-layer PCB the terms that are typically used for pads are “functional” (pads that actually carry a signal to the PTH) and “non-functional” (pads that DO NOT carry a signal to the PTH).  This may be what is meant by “active” and “dummy”.



The designer has 2 choices for pads when designing a PCB.



First is to include pads on each layer connecting to the PTH.  This would include both functional and non-functional.  This has the benefit of reducing the amount of resin in the z-axis and therby reduces overall z-axis expansion of the PTH when exposed to heat.  The negative side to this approach is that it leaves many more opportunities for “shorts” between the non-functional pads and the surrounding circuitry.



The second choice is to remove these non-functional (non signal carrying) pads from the design.  This significantly decreases the possible failure due to shorts, but increases the resin content of the PTH area and increases the Z-Axis expansion during heat exposure.





Best Regards,



Bob Neves

Chairman/CTO

Microtek Laboratories

Anaheim, CA

+1 (714) 999-1616

Changzhou, China

+86 (519) 548-7805

[log in to unmask]

www.TheTestLab.com





________________________________

From: TGAsia [mailto:[log in to unmask]] On Behalf Of Chris Katzko
Sent: Tuesday, May 15, 2007 4:42 PM
To: [log in to unmask]
Subject: [TGA] 答复: Re: [TGA] active pad and dummy pad




Good question,.  Is it Active/Dummy pad for PCB or for BGA component? In the case of BGA, the Active pad would have electrical connections, the Dummy pad would be for mechanical attachment and thermal enhancement.

C.B. Katzko, CTO
Meadville Group
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tel            +86 21 5774 6907
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mobile   +86 13817362590



JiaXing LIU <[log in to unmask]>
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2007-05-15 16:25

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Re: [TGA] active pad and dummy pad










Su

Active pad and dummy pad used in PCB processs or any other process?



Best reagrds

Jason Liu
Asia Pacific Strategic Sourcing
SDE

TRW Systems Consulting Services(Shanghai) Co., Ltd.
5F, 62 Building, 421 Hongcao Road,
Shanghai 200233, P.R.China
Tel:+86 21 6120 1166 or 6120 2266
Dir Tel:+86 21 6121 1811
Fax:+86 21 6120 7058
Mobile:+86 138 1895 6432
Email:[log in to unmask]


>>> Su Shibo <[log in to unmask]> 2007-5-15 15:49:45 >>>
Hi All,

Who knows those two items "Active pad" and "Dummy pad" in Chinese?

Many thanks,

Regards,



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