Don't wait, register today for IPC's workshops, in Singapore, on the following topics: Compliant Electronics for EU Applications: May 28-29, 2007 Flexible Circuit Design Principles and Fabrication Requirements: June 7, 2007 Interconnect Technology Roadmapping Overview: June 7, 2007 Lead Free Component (Sn-Whisker), PCB (Materials), and Assembly (Solder-Joint Reliability) Issues and Solutions: June 8, 2007 Compliant Electronics for EU Applications May 28 & 29, 2007 Singapore, SG Instructor: Dieter Bergman, IPC Are you complying with the regulations developed by the European Union? It is becoming one of the biggest challenges facing designers, fabricators, and assemblers in the electronics interconnection industry. This two-day workshop explores the actions necessary to be an active player in tomorrow's electronics industry. Here's your opportunity to get up-to-date! Flexible Circuit Design Principles and Fabrication Requirements June 7, 2007: 8:30 am - 11:30 am Singapore, SG Instructor: Vern Solberg, MicroElectronic Engineering Services The workshop will review flexible substrate material specifications and standards developed to guide flex manufacturers and users. Material will be presented that includes flex-circuit metallization technologies and a number of fabrication methodologies comparing subtractive to semi-additive plating technologies and panel processes to tape and reel. Design guidelines for SMT will offer variations for land pattern development, two metal layer via hole planning and methods used for maximizing circuit routing densities and techniques for circuit reinforcement. This interactive half-day workshop has been developed specifically for design professionals, IC packaging specialists, quality managers and inspectors, systems engineers as well as assembly and test engineering specialists for the OEM, ODM and EMS providers. Interconnect Technology Roadmapping Overview June 7, 2007: 1:00 pm - 4:00 pm Singapore, SG Instructor: John T. Fisher, Interconnect Technology Analysis, Inc. This session will provide an excellent base of knowledge for attendees on Technology Roadmapping. It will cover the elements of major technology roadmaps referenced in the interconnect industry, the IPC's International Technology Roadmap for Electronic Interconnections, iNEMI's International Technology Roadmap, the SIA's International Technology Roadmap for Semiconductors and the Japanese JISSO roadmap. The workshop will review and compare the basis or purpose of the roadmaps, which are all different. The types of different resources used by the individual roadmap teams and the impact of those resources on the roadmap outcome. Attendees will also learn the differences in industry roadmaps and corporate roadmaps and how corporate roadmaps may fit into the company business planning activity. The workshop is not intended to be a technology attribute comparison or analysis, but rather a business - technology analysis of the roadmaps. Lead Free Component (Sn-Whisker), PCB (Materials), and Assembly (Solder-Joint Reliability) Issues and Solutions June 8, 2007: 8:30 am - 4:30 pm Instructor: John Lau, Micro, Institute of Microelectronics In this full-day course, some critical issues and their solutions of lead free soldering (such as the latest EU and China regulations, cost, design, materials, forward and backward-process incompatibility, inspections, tests, and reliability of components, PCBs, tin whiskers, and solder joints) will be presented. Emphasis is placed on the lead free critical issues and solutions of the most popular SMT packages such as PQFP, PBGA, CSP, and flip-chip WLCSP. Register today for these exciting workshops taking place in Singapore. Please cut and paste www.ipc.org/SingaporeWS07 into your browser to download the registration form. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------