Ioan, I am not using any leadfree. My company's products are presently exempt, so my efforts were only exploratory. The SN100C became available last year after I had already started processing my leadfree test assemblies. I was only able to populate some double-side reflow assemblies using the SN100C. The oven recipe was the one I had developed for SAC305, with a little boost in the reflow zone. We also ran mixed alloy assemblies (reflowed SAC305/wave SN100C). Board finishes were ENIG and Iag. All assemblies past our qualification testing. Gary -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan Sent: Monday, April 30, 2007 2:31 PM To: [log in to unmask] Subject: Re: [TN] SN100C vs. SAC305 Gary, I've told you I was behind on that. I'll contact AIM. You have tested it, but are you using it? We still dream about having a standard material, so that the new developments be faster communicated and redily applicable by everybody. If the reliability research is mainly on SAC, who will take care of the SN100C? John, I've originally sent it to leadfree also, but the message bounced back. I have to figure this one out. Which brings me back to the question I have already asked at least twice: why is IPC still keeping 2 forums? TN and LF are practically populated by the same persons, with the same interests. Thanks, Ioan -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Gary Camac Sent: Monday, April 30, 2007 3:03 PM To: [log in to unmask] Subject: Re: [TN] SN100C vs. SAC305 Iaon, Concerning your second bullet point, I successfully tested a SN100C paste from AIM last year. Gary Camac -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan Sent: Monday, April 30, 2007 1:42 PM To: [log in to unmask] Subject: [TN] SN100C vs. SAC305 Dear Technos, I need to know how is this combat evolving. This topic has been brought up several times, but things change fast right now and there must be more empirical data on the matter. What I know regarding the 2 materials can be summarized: * Pro SN100C: cheaper, better looking, eats less copper in the TH * One major unknown - the Reliability: SN100C is not available in solder paste format, therefore the boards would have SAC SMT joints and SN100C TH joints. This means 2 different materials and since we don't know how reliable a board with only one material is, should we risk introducing an extra variable? I would like to know what your take is. Does anybody mixes the 2 materials? Any reliability testing done? How long have you been doing it and do you see RMAs? Thanks, Ioan --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------