I saw a presentation on this material at an IMAPS meeting. It is based on German engineering using Molybdenum powder in a mixture to meet specified TCE and thermal attributes. It was interesting, expensive, an would demand some thoughtful design work. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Randy Bock Sr. Sent: Thursday, May 31, 2007 8:03 AM To: [log in to unmask] Subject: Re: [TN] Conductive Cooling thru Pre-Prig material We do not use this type of material but did find the web link very interesting... Randy Bock Sr. Quality Engineer Enterprise Quality Assurance AddressRight Printers (email) [log in to unmask] Newtown Building 2 203 270-4931 Ext 8-426-4931 In 203 270-4982 Fax This e-mail message may contain confidential, proprietary and/or privileged information. It is intended only for the use of the intended recipient(s). If you receive this in error, please immediately advise the sender by reply e-mail and delete this e-mail message. Any disclosure, copying, distribution or use of the information contained in the e-mail to or by anyone other than the intended recipient is strictly prohibited. Any views expressed in this message are those of the individual sender, except when the sender specifically states them to be the views of the company. Thank You. Steve Gregory <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 05/31/2007 07:57 AM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to Steve Gregory <[log in to unmask]> To [log in to unmask] cc Subject Re: [TN] Conductive Cooling thru Pre-Prig material Good Morning Terry! Although I don't have any experience with this material, it looks very, very interesting. Check this out: http://www.stablcor.com/presentation/ At the last company I worked at we were about to try the material in a single board computer assembly that we had the task of ruggedizing, but we ran into some issues with our customer that I won't get into... Only drawback that I can initially see is that it is electrically conductive and only licensed to a half-dozen fabs shops here in the US. Maybe there might be some way that you can use this in your design. Steve Gregory -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Terry Kozlyk Sent: Thursday, May 31, 2007 6:02 AM To: [log in to unmask] Subject: [TN] Conductive Cooling thru Pre-Prig material Technetters; I have a 6 layer PCB with about 8 HOT DPAK components. The tabs are electrically hot so I cannot just draw the heat directly thru a copper fill brought out to the edge of the PCB. I need electrical isolation, BUT high thermal conductivity between 2 adjacent layers. Can anyone recommend what material they have specified to be used for pre-prig that conducted the heat to the adjacent layer? Voltage max is about 50 volts so I could probably go down to 2 or 3 mil pre-prig. Nothing special about this PCB; about 5" x 5". The fab houses I solicited for info still haven't replied so I am curious. Any leads, products or websites would be appreciated. Regards TDK --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------