Hi All -
Maye the backpanel assemblers should be the judge, but if the related
technical data is not already available, suggest to consider the
short-term need for this information verses time to get it through the
review process. If we need Chinese translations of the existing spec fast,
that may outweigh including the new technology. I only mentioned this
originally to see if it could/should be included.
Sorry to put you to trouble on this, I'm a CTO so my job is to stir the
pot, it's ok to ignore me when I get out ofline.
C.B. Katzko, CTO
Meadville Group
e-mail [log in to unmask]
tel +86 21 5774 6907
fax +86 21 5774 0635
mobile +86 13817362590
"Leesha Peng" <[log in to unmask]>
2007-04-24 13:32
收件人
"Chris Katzko" <[log in to unmask]>,
<[log in to unmask]>
抄送
主题
答复: [TGA] 答复: [TGA] 答复: [TGA] 答复: [TGA] 答复: Re : [TGA] Hi all,
is t here any specification abo ut "pressfit" tec hnology? thanks!
Hi Chris,
Thanks very much. So in your opinion, it's worth updating this document,
right? Or submit it to 610 committee.
How about you, Dave? We have had some other issue like this, such as the
test methods discussed by Huawei and Flextronics.
Thanks
Leesha Peng 彭丽霞
标准开发/设计课程与技术资源项目总监
Director, Standards/Design Programs
& Technical Resources
上海市延安西路1088号2303室
邮编：200052
手机:13902994705
________________________________
From: TGAsia 代表 Chris Katzko
Sent: 2007-4-23 (星期一) 23:01
To: [log in to unmask]
Subject: [TGA] 答复: [TGA] 答复: [TGA] 答复: [TGA] 答复: Re : [TGA] Hi
all, is t here any specification abo ut "pressfit" tec hnology? thanks!
Hi Leesha,
I don't mean to say press-fit will be used less, but that some backpanel
designs may include surface mount connectors as well. My understanding is
the applications would be high-speed, high signal integrety products such
as Dacom switch fabric where you have some very high-speed interfaces
sensitive to inductance.
A couple of years ago we were reviewing a draft standard from IPC/JPCA on
datacom interconnection in the WECC group, and this technology was
included as I recall, David might be able to recall the exact document.
Regards,
C.B. Katzko, CTO
Meadville Group
e-mail [log in to unmask]
tel +86 21 5774 6907
fax +86 21 5774 0635
mobile +86 13817362590
Leesha Peng <[log in to unmask]>
发件人: TGAsia <[log in to unmask]>
2007-04-23 21:01
请答复 给
Asia Committe Task Group Forum <[log in to unmask]>; 请答复 给
Leesha Peng <[log in to unmask]>
收件人
[log in to unmask]
抄送
主题
[TGA] 答复: [TGA] 答复: [TGA] 答复: Re: [TGA] Hi all, is t here any
specification abo ut "pressfit" tec hnology? thanks!
Dear Chris,
Thanks for sharing. Did you imply that the press-fit will be using less
and less? I am curious why IPC committee has stopped working on it.
Thanks
Leesha Peng 彭丽霞
标准开发/设计课程与技术资源项目总监
Director, Standards/Design Programs
& Technical Resources
上海市延安西路1088号2303室
邮编：200052
手机:13902994705
________________________________
From: Chris Katzko [mailto:[log in to unmask]]
Sent: 2007-4-23 (星期一) 0:29
To: Asia Committe Task Group Forum; Leesha Peng
Cc: [log in to unmask]
Subject: 答复: [TGA] 答复: [TGA] 答复: Re: [TGA] Hi all, is t here any
specification about "pressfit" tec hnology? thanks!
Dear Leesha et al,
If were going to take this on, it may be importiant to recruit
representatives from press-fit Pin/Connector manufactureres in addition to
Backpanel MFG to get buy-in on any changes. They would also be able to
help define & update Best Practice & Workmanship Standards.
Lastly, I think some high performance backpanels are migrating toward
surface mount connectors for critical low-loss I/O's we may want to
consider including this unless the requirements are already specifed
elsewhere (eg, A-610). I believe Teradyne and/or Tyco may be develping
such connector systems.
C.B. Katzko, CTO
Meadville Group
e-mail [log in to unmask]
tel +86 21 5774 6907
fax +86 21 5774 0635
mobile +86 13817362590
Leesha Peng <[log in to unmask]>
发件人: TGAsia <[log in to unmask]>
2007-04-23 11:53
请答复 给
Asia Committe Task Group Forum <[log in to unmask]>; 请答复 给
Leesha Peng <[log in to unmask]>
收件人
[log in to unmask]
抄送
主题
[TGA] 答复: [TGA] 答复: Re: [TGA] Hi all, is t here any specification
about "pressfit" tec hnology? thanks!
I think it's a good idea.
Hi John and Dave,
At this point we should announce it for more interests, right?
Leesha Peng 彭丽霞
标准开发/设计课程与技术资源项目总监
Director, Standards/Design Programs
& Technical Resources
上海市延安西路1088号2303室
邮编：200052
手机:13902994705
________________________________
From: TGAsia 代表 Zhang Yali
Sent: 2007-4-22 (星期日) 22:10
To: [log in to unmask]
Subject: [TGA] 答复: Re: [TGA] Hi all, is there any specification about
"pressfit" technology? thanks!
Thanks a lot to Mr.Perry and Mr.Bergman's information, I really appreciate
it.
Pity that there are no updates of that two documents. It's really
important for backpanel.
I wonder if there is any possibility to set up subcommittee to update
IPC-BP-421 (backplanes with pressfit) and D-422 (design for backplanes) ?
Regards!
John Perry <[log in to unmask]>
发件人： TGAsia <[log in to unmask]>
2007-04-20 22:45
请答复 给 Asia Committe Task Group Forum; 请答复 给 John Perry
收件人： [log in to unmask]
抄送：
主题： Re: [TGA] Hi all, is there any specification about
"pressfit" technology? thanks!
Hello Zhang,
There was once an IPC D-34 Backplane Subcommittee and they were in the
process of developing updated acceptance criteria for press-fit connectors
for IPC-BP-421, but that effort did not result in an update to the
BP-421document. Instead, the subcommittee updated the acceptance criteria
and submitted it to the IPC 7-31b IPC-A-610 task group.
The material in section 4.3, Connector Pins, of IPC-A-610D, Acceptability
of Electronic Assemblies, represents the updated criteria from the IPC
D-34 subcommittee, which disbanded after the publication of IPC-A-610D.
Regards,
John Perry
Technical Project Manager
IPC
3000 Lakeside Drive # 309S
Bannockburn, IL 60015
[log in to unmask]
1-847-597-2818 (P)
1-847-615-7105 (F)
1-847-615-7100 (Main)
________________________________
From: TGAsia [mailto:[log in to unmask]] On Behalf Of David Bergman
Sent: Friday, April 20, 2007 7:47 AM
To: [log in to unmask]
Subject: Re: [TGA] Hi all, is there any specification about "pressfit"
technology? thanks!
Hi Zhang,
IPC had a couple of documents IPC-BP-421 (backplanes with pressfit) and
D-422 (design for backplanes) Unfortunately they are really old (early
80s) and we could not get the committees to complete an update.
Best regards,
Dave
David W. Bergman, CAE
Vice President, Standards, Technology and International Relations
IPC
3000 Lakeside Drive # 309S
Bannockburn, IL 60015
Phone 847-597-2840 Fax 847-615-5640
Mobile 847-867-1388
Main 847-615-7100
email [log in to unmask] www.ipc.org <http://www.ipc.org/>
________________________________
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Zhang Yali
Sent: Friday, April 20, 2007 12:56 AM
To: [log in to unmask]
Subject: [TGA] Hi all, is there any specification about "pressfit"
technology? thanks!
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