There's an interesting article that sort of talks to your question in Fridays SMT. http://urltea.com/5vu KennyB -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Hfjord Sent: Monday, April 16, 2007 12:54 PM To: [log in to unmask] Subject: [TN] Placement of large flatpacks and BGAs close to board edge Dear collegues, I have heard of a thumb rule, never place them along and close to the edge. Hence, we place them (when suitable) in the center. I have forgotten why this rule. Was it because of vibration nodes, warpage during soldering, tempcycle issues or what? Is there a IPC standard or other reference? Inge --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------