Hi 'Netters, Can anybody send me a good copy of Fig. 10 of Yoon, S., et al, (Hyundai) “CSP Board Level Reliability Testing of Pb-Free Sn-Ag-X (X=Cu, In) and Polymer-Core Solder Ball,” Proc. 6th Annual Pan Pacific Microelectronics Symp., Kauai, Hawaii, February 2001? Downloading from the SMTA database is not a solution, because their copy is not legible either; so I am hoping somebody who was at that conference may have a better copy. E-mailing the author is also not a solution because the address given is non-working. Werner ************************************** See what's free at http://www.aol.com. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------