Kenny, We put a "via farm" in a u shape around the outer edge of a D2PAK. This is on the same copper as the component but has a mask strip to keep the components solder at the component. Regards, Jerry Dengler Production Manager Pergamon Corporation PH: 610-239-0721 Fax: 610-239-0720 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Bloomquist, Ken Sent: Thursday, April 05, 2007 11:43 AM To: [log in to unmask] Subject: [TN] Thermal via's on D2PAK Do any of you see an issue with putting thermal via's under the bodies of a D2PAK? Do you have any recommendations for the number or size or the via's to help transfer heat to the other side of the board? Thanks, KennyB --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------