Vladimir: Has TI made the process improvements in the Paladium thichness at its optimum so that solder joint is more reliable and easier to obtain? Regards, Ramon -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev Sent: Thursday, April 05, 2007 9:57 AM To: [log in to unmask] Subject: Re: [TN] NiPdAu FINISH Hi George, Pb doesn't form any intermetallics with Au (or Ni, or Cu for that matter) either. :-) Pd and Sn might a problem if a layer of Pd is too thick. Regards, Vladimir AMD -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of George Milad Sent: Thursday, April 05, 2007 9:46 AM To: [log in to unmask] Subject: Re: [TN] NiPdAu FINISH Ni/Pd/Au makes relatively weak solder joint with Sn/Pb eutectic solder. This is caused by the incompatibility of Pd with the Pb component of the solder. Pd and Pb do not form an intermetallic. The good news is Ni/Pd/Au makes a very robust solder joint with SAC alloy or lead free solder. The details were published in the Apex proceedings of 2006. Regards George Milad George Milad National Accounts Manager for Technology Uyemura International Corp (UIC) 249 Town Line Rd Southington CT 06489 [log in to unmask] Cell: (516) 901 3874 ************************************** See what's free at http://www.aol.com. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------